Han; Hyun-Joo

Patent Applications and Registrations

Patent applications and USPTO patent grants for Han; Hyun-Joo.The latest application filed is for "display apparatus and method of controlling the same".

Company Profile

2.6.10

Han; Hyun-Joo - Gyeonggi-do KR
- Gyeonggi-do KR
HAN; Hyun Joo - Yongin-si KR
Han; Hyun Joo - Uiwang-si KR
Han; Hyun Joo - Suwon-si KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing printed-circuit board assembly Grant 10,426,041 - Bang , et al. Sept	2019-09-24
Method of manufacturing printed-circuit board assembly Grant 10383235 -	2019-08-13
Display Apparatus And Method Of Controlling The Same App 20180032201 - SONG; Bong Min ; et al.	2018-02-01
Thermoplastic resin composition and article comprising the same Grant 9,771,467 - Han , et al. September 26, 2	2017-09-26
Method Of Manufacturing Printed-circuit Board Assembly App 20160120039 - BANG; Jung-Je ; et al.	2016-04-28
Silane compound, method for preparing the same, and polycarbonate resin composition including the same Grant 9,321,886 - Bae , et al. April 26, 2	2016-04-26
Thermoplastic Resin Composition and Article Comprising the Same App 20150344670 - HAN; Hyun Joo ; et al.	2015-12-03
Silane compound, method for preparing the same and polycarbonate resin composition comprising the same Grant 9,085,674 - Kim , et al. July 21, 2	2015-07-21
Silane Compound, Method for Preparing the Same, and Polycarbonate Resin Composition Including the Same App 20150148471 - BAE; Su Hak ; et al.	2015-05-28
Silane Compound, Method for Preparing the Same and Polycarbonate Resin Composition Comprising the Same App 20150148472 - KIM; Yong Tae ; et al.	2015-05-28
Polycarbonate Resin Composition and Molded Article Including the Same App 20150140248 - RA; Ha Na ; et al.	2015-05-21
Silane Compound, Method for Preparing the Same, and Polycarbonate Resin Composition Including the Same App 20140378589 - BAE; Su Hak ; et al.	2014-12-25
Method of fabricating printed circuit board assembly Grant 8,327,534 - Park , et al. December 11, 2	2012-12-11
Method of fabricating printed circuit board assembly App 20110154661 - Park; Min Young ; et al.	2011-06-30
IC package and method of manufacturing the same Grant 7,755,181 - Han , et al. July 13, 2	2010-07-13
Printed circuit board assembly and manufacturing method for the same App 20090139758 - Shin; Hyo Young ; et al.	2009-06-04
Ic Package And Method Of Manufacturing The Same App 20080157326 - HAN; Hyun Joo ; et al.	2008-07-03

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