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Patent applications and USPTO patent grants for Han; Chung Chyung (Justin).The latest application filed is for "package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate".
Patent | Date |
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Package assembly including a semiconductor substrate in which a first portion of a surface of the semiconductor substrate is recessed relative to a second portion of the surface of the semiconductor substrate to form a recessed region in the semiconductor substrate Grant 9,768,144 - Wu , et al. September 19, 2 | 2017-09-19 |
Recessed semiconductor substrates and associated techniques Grant 9,391,045 - Wu , et al. July 12, 2 | 2016-07-12 |
Package Assembly Including A Semiconductor Substrate In Which A First Portion Of A Surface Of The Semiconductor Substrate Is Recessed Relative To A Second Portion Of The Surface Of The Semiconductor Substrate To Form A Recessed Region In The Semiconductor Substrate App 20160155732 - Wu; Albert ;   et al. | 2016-06-02 |
Recessed Semiconductor Substrates And Associated Techniques App 20150279806 - Wu; Albert ;   et al. | 2015-10-01 |
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