HAN; Charlie
Patent Applications and Registrations
Patent applications and USPTO patent grants for HAN; Charlie.The latest application filed is for "system and method for absorbing moisture within a face mask".
- HAN; Charlie - Morris Plains NJ
- Han; Charlie - Hsin-Chu TW
- Han, Charlie - Hsinchu TW
- Han; Charlie - Hsin-Chu Hsien TW
- Han, Charlie - Hsinchu Hsien TW
| Patent | Date |
|---|---|
| System And Method For Absorbing Moisture Within A Face Mask App 20200359717 - HAN; Charlie ; et al. | 2020-11-19 |
| Integrated circuit packages and the method for making the same Grant 6,846,697 - Ho , et al. January 25, 2 | 2005-01-25 |
| Method for determining failure rate and selecting best burn-in time Grant 6,820,029 - Fang , et al. November 16, 2 | 2004-11-16 |
| Universal serial bus interface memory controller and associated memory App 20040039851 - Tang, Jerry ; et al. | 2004-02-26 |
| Method of fabricating an LC panel Grant 6,669,520 - Hung , et al. December 30, 2 | 2003-12-30 |
| Flash memory bridiging device, method and application system App 20030206442 - Tang, Jerry ; et al. | 2003-11-06 |
| Method of fabricating an LC panel App 20030054722 - Hung, Chin-Lung ; et al. | 2003-03-20 |
| Backpanel structure of liquid crystal on silicon App 20030048397 - Hung, Chin-Lung ; et al. | 2003-03-13 |
| Method of forming package Grant 6,461,956 - Hsuan , et al. October 8, 2 | 2002-10-08 |
| Integrated circuit packages and the method for the same App 20020111008 - Ho, Kai-Kuang ; et al. | 2002-08-15 |
| Integrated circuit packages and the method for the same App 20020102833 - Ho, Kai-Kuang ; et al. | 2002-08-01 |
| Method for determining failure rate and selecting best burn-in time App 20020082796 - Fang, Walx ; et al. | 2002-06-27 |
| Method of fabricating direct contact through hole type Grant 6,352,923 - Hsuan , et al. March 5, 2 | 2002-03-05 |
| Dual-dies packaging structure and packaging method App 20010054761 - Han, Charlie ; et al. | 2001-12-27 |
| Direct contact through hole type wafer structure Grant 6,323,546 - Hsuan , et al. November 27, 2 | 2001-11-27 |
| Direct contact through hole type wafer structure App 20010005046 - Hsuan, Min Chih ; et al. | 2001-06-28 |
| Direct contact through hole type wafer structure Grant 6,252,300 - Hsuan , et al. June 26, 2 | 2001-06-26 |
| Wafer level integrated circuit structure and method of manufacturing the same Grant 6,214,630 - Hsuan , et al. April 10, 2 | 2001-04-10 |
| Cascade-type chip module Grant 6,166,444 - Hsuan , et al. December 26, 2 | 2000-12-26 |
| Multi-chip module package Grant 6,133,629 - Han , et al. October 17, 2 | 2000-10-17 |
| Circuit for burn-in operation on a wafer of memory devices Grant 5,995,428 - Chien , et al. November 30, 1 | 1999-11-30 |
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