Han; Caleb C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Han; Caleb C..The latest application filed is for "blood pressure monitoring system including a liquid filled sensor".

Company Profile

1.7.9

Han; Caleb C. - Santa Clara CA
Han; Caleb C. - San Jose CA
Han; Caleb C. - Sunnyvale CA
Han; Caleb C. - Phoenix AZ US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Exposed wire-bonding for sensing liquid and water in electronic devices Grant 11,422,104 - Han , et al. August 23, 2	2022-08-23
Blood Pressure Monitoring System Including a Liquid Filled Sensor App 20220240803 - Han; Caleb C. ; et al.	2022-08-04
Exposed Wire-bonding For Sensing Liquid And Water In Electronic Devices App 20210072176 - Han; Caleb C. ; et al.	2021-03-11
Various stress free sensor packages using wafer level supporting die and air gap technique Grant 10,041,847 - Han , et al. August 7, 2	2018-08-07
Integrated Mems Microphone And Vibration Sensor App 20170156002 - Han; Caleb C. ; et al.	2017-06-01
Various Stress Free Sensor Packages Using Wafer Level Supporting Die And Air Gap Technique App 20170089783 - Han; Caleb C. ; et al.	2017-03-30
Various stress free sensor packages using wafer level supporting die and air gap technique Grant 9,574,959 - Han , et al. February 21, 2	2017-02-21
Various Stress Free Sensor Packages Using Wafer Level Supporting Die And Air Gap Technique App 20160061677 - Han; Caleb C. ; et al.	2016-03-03
Lead frame array package with flip chip die attach Grant 8,969,139 - Han March 3, 2	2015-03-03
Lead Frame Array Package With Flip Chip Die Attach App 20140220738 - HAN; CALEB C.	2014-08-07
Lead frame array package with flip chip die attach Grant 8,710,636 - Han April 29, 2	2014-04-29
Method And System For Wafer And Strip Level Batch Die Attach Assembly App 20130285259 - Han; Caleb C.	2013-10-31

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