Hamzehdoost; Ahmad
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hamzehdoost; Ahmad.The latest application filed is for "bga package using pcb and tape in a die-up configuration".
- Hamzehdoost; Ahmad - Sacramento CA
| Patent | Date |
|---|---|
| BGA package using PCB and tape in a die-up configuration Grant 6,069,407 - Hamzehdoost May 30, 2 | 2000-05-30 |
| BGA package using PCB and tape in a die-down configuration Grant 5,999,415 - Hamzehdoost December 7, 1 | 1999-12-07 |
| Method of assembling and cooling a package structure with accessible chip Grant 5,687,474 - Hamzehdoost , et al. November 18, 1 | 1997-11-18 |
| Multi-layer substrate structure Grant 5,689,091 - Hamzehdoost , et al. November 18, 1 | 1997-11-18 |
| Package structure having accessible chip Grant 5,491,362 - Hamzehdoost , et al. February 13, 1 | 1996-02-13 |
| Plastic encapsulated integrated circuit package having an embedded thermal dissipator Grant 5,430,331 - Hamzehdoost , et al. July 4, 1 | 1995-07-04 |
| Package structure and method for reducing bond wire inductance Grant 5,371,321 - Hamzehdoost , et al. December 6, 1 | 1994-12-06 |
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