loadpatents
Patent applications and USPTO patent grants for Hamilton; Roger D..The latest application filed is for "integrated circuit device assembly".
Patent | Date |
---|---|
Integrated circuit device assembly Grant 10,779,391 - Barron , et al. Sept | 2020-09-15 |
Module placement apparatus Grant 10,109,975 - Eagle , et al. October 23, 2 | 2018-10-23 |
Integrated Circuit Device Assembly App 20180160524 - BARRON; David ;   et al. | 2018-06-07 |
Integrated circuit device assembly Grant 9,913,361 - Barron , et al. March 6, 2 | 2018-03-06 |
Integrated Circuit Device Assembly App 20170196075 - Barron; David ;   et al. | 2017-07-06 |
Module Placement Apparatus App 20170133810 - Eagle; Jason R. ;   et al. | 2017-05-11 |
Implementing heat sink loading having multipoint loading with actuation outboard of heatsink footprint Grant 9,265,157 - Colbert , et al. February 16, 2 | 2016-02-16 |
Implementing Heat Sink Loading Having Multipoint Loading With Actuation Outboard Of Heatsink Footprint App 20140268575 - Colbert; John L. ;   et al. | 2014-09-18 |
Implementing loading and heat removal for hub module assembly Grant 8,363,404 - Colbert , et al. January 29, 2 | 2013-01-29 |
Implementing Loading And Heat Removal For Hub Module Assembly App 20120147563 - Colbert; John L. ;   et al. | 2012-06-14 |
Topside installation apparatus for land grid array modules Grant 6,802,733 - Colbert , et al. October 12, 2 | 2004-10-12 |
Method of installing a land grid array multi-chip modules Grant 6,757,965 - Colbert , et al. July 6, 2 | 2004-07-06 |
Apparatus for mounting a land grid array module Grant 6,634,095 - Colbert , et al. October 21, 2 | 2003-10-21 |
Holding member for the installation of land grid array multi-chip modules App 20030192180 - Colbert, John L. ;   et al. | 2003-10-16 |
Topside Installation apparatus for land grid array modules App 20030036301 - Colbert, John L. ;   et al. | 2003-02-20 |
Holding member for the installation of land grid array multi-chip modules App 20030000080 - Colbert, John L. ;   et al. | 2003-01-02 |
Land grid array socket actuation hardware for MCM applications Grant 6,475,011 - Sinha , et al. November 5, 2 | 2002-11-05 |
Printed circuit board covers for an electronics package Grant 5,617,296 - Melville , et al. April 1, 1 | 1997-04-01 |
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