Hamburgen; William R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hamburgen; William R..The latest application filed is for "independently mounted cooling fins for a low-stress semiconductor package".

Company Profile

0.16.0

Hamburgen; William R. - Palo Alto CA
Hamburgen; William R. - Menlo Park CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Independently mounted cooling fins for a low-stress semiconductor package Grant 6,208,513 - Fitch , et al. March 27, 2	2001-03-27
Integrated thermal coupling for a heat generating device Grant 6,034,430 - Hamburgen , et al. March 7, 2	2000-03-07
Integrated thermal coupling for heat generating device Grant 5,838,065 - Hamburgen , et al. November 17, 1	1998-11-17
High powered die with bus bars Grant 5,629,840 - Hamburgen , et al. May 13, 1	1997-05-13
Paddleless molded plastic semiconductor chip package Grant 5,604,376 - Hamburgen , et al. February 18, 1	1997-02-18
Thermosiphon for cooling a high power die Grant 5,582,242 - Hamburgen , et al. December 10, 1	1996-12-10
Semiconductor heat removal apparatus with non-uniform conductance Grant 5,247,426 - Hamburgen , et al. September 21, 1	1993-09-21
Integrated circuit protection by liquid encapsulation Grant 5,243,756 - Hamburgen , et al. September 14, 1	1993-09-14
Integrated circuit test fixture and method Grant 5,198,753 - Hamburgen March 30, 1	1993-03-30
Integrated circuit protection by liquid encapsulation Grant 5,130,889 - Hamburgen , et al. July 14, 1	1992-07-14
Micro-channel wafer cooling chuck Grant 5,115,858 - Fitch , et al. May 26, 1	1992-05-26
Method for providing a thermal transfer device for the removal of heat from packaged elements Grant 5,083,373 - Hamburgen January 28, 1	1992-01-28
Evaporator having etched fiber nucleation sites and method of fabricating same Grant 4,995,451 - Hamburgen February 26, 1	1991-02-26
Composite graphite heat pipe apparatus and method Grant 4,966,226 - Hamburgen October 30, 1	1990-10-30
Apparatus and method for cooling electronic component packages using an array of directed nozzles fabricated in the circuit board Grant 4,839,774 - Hamburgen June 13, 1	1989-06-13
Apparatus and method for removal of heat from packaged element Grant 4,800,956 - Hamburgen January 31, 1	1989-01-31

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