Hamatani; Tsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hamatani; Tsuyoshi.The latest application filed is for "semiconductor device and method for manufacturing the same".

Company Profile

0.11.15

Hamatani; Tsuyoshi - Shiga JP
Hamatani; Tsuyoshi - Otsu JP
Hamatani, Tsuyoshi - Otsu-shi JP
Hamatani; Tsuyoshi - Ohtsu JP
Hamatani, Tsuyoshi - Ohtsu-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device Grant 7,777,304 - Hamatani , et al. August 17, 2	2010-08-17
Semiconductor device and method of manufacturing the same Grant 7,622,792 - Watase , et al. November 24, 2	2009-11-24
Semiconductor Device And Method For Manufacturing The Same App 20090184428 - HAMATANI; Tsuyoshi	2009-07-23
Electrode pad section for external connection Grant 7,391,114 - Mimura , et al. June 24, 2	2008-06-24
Semiconductor device and method for the fabrication thereof including grinding a major portion of the frame Grant 7,309,624 - Fujimoto , et al. December 18, 2	2007-12-18
Semiconductor device App 20070138638 - Ota; Yukitoshi ; et al.	2007-06-21
Semiconductor device and method of manufacturing the same App 20070132096 - Watase; Kazumi ; et al.	2007-06-14
Semiconductor device which employs an interlayer insulating film of a low mechanical strength and a highly reliable metal pad, and a method of manufacturing the same Grant 7,202,565 - Matsuura , et al. April 10, 2	2007-04-10
Semiconductor device App 20070029641 - Hamatani; Tsuyoshi ; et al.	2007-02-08
Semiconductor device App 20070023927 - Nagai; Noriyuki ; et al.	2007-02-01
Semiconductor device and method for the fabrication thereof App 20060252183 - Fujimoto; Hiroaki ; et al.	2006-11-09
Semiconductor device and method for the fabrication thereof grinding frame portion such that plural electrode constituent portions Grant 7,125,751 - Fujimoto , et al. October 24, 2	2006-10-24
Semiconductor device App 20050173801 - Mimura, Tadaaki ; et al.	2005-08-11
Semiconductor device and method for the fabrication thereof App 20050133892 - Fujimoto, Hiroaki ; et al.	2005-06-23
Semiconductor device and method of manufacturing the same App 20050054188 - Matsuura, Masazumi ; et al.	2005-03-10
Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device Grant 6,856,026 - Yamada , et al. February 15, 2	2005-02-15
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same Grant 6,835,600 - Utsumi , et al. December 28, 2	2004-12-28
Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device Grant 6,693,358 - Yamada , et al. February 17, 2	2004-02-17
Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device App 20040017012 - Yamada, Yuichiro ; et al.	2004-01-29
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same App 20030203541 - Utsumi, Masaki ; et al.	2003-10-30
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same Grant 6,603,194 - Utsumi , et al. August 5, 2	2003-08-05
Semiconductor device and method for the fabrication thereof App 20030038359 - Fujimoto, Hiroaki ; et al.	2003-02-27
Semiconductor device and method for the fabrication thereof Grant 6,498,393 - Fujimoto , et al. December 24, 2	2002-12-24
Lead frame and method for fabricating resin-encapsulated semiconductor device using the same App 20020109973 - Utsumi, Masaki ; et al.	2002-08-15
Semiconductor chip, wiring board and manufacturing process thereof as well as semiconductor device App 20020047210 - Yamada, Yuichiro ; et al.	2002-04-25
Semiconductor device and method for the fabrication thereof App 20010040286 - Fujimoto, Hiroaki ; et al.	2001-11-15

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