Patent | Date |
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Gas Concentration Device, Gas Detection System, Gas Concentration Method, And Gas Detection Method App 20220307952 - HAMASAKI; Hiroshi ;   et al. | 2022-09-29 |
Chemical Sensor Module And Method For Detecting Hydrophobic Target Molecules App 20220276200 - SUGIZAKI; Yoshiaki ;   et al. | 2022-09-01 |
Analysis Chip App 20210096099 - Kobayashi; Kentaro ;   et al. | 2021-04-01 |
Particle inspection system and driving method employed therein Grant 10,533,934 - Nishigaki , et al. Ja | 2020-01-14 |
Microanalysis chip Grant 10,337,976 - Nishigaki , et al. | 2019-07-02 |
Semiconductor micro-analysis chip and method of manufacturing the same Grant 10,281,429 - Kobayashi , et al. | 2019-05-07 |
Detection Device, Detection Method, And Electrode With Probe App 20190064157 - MIYAGAWA; Takuya ;   et al. | 2019-02-28 |
Semiconductor analysis chip and particle inspection method Grant 10,113,947 - Kobayashi , et al. October 30, 2 | 2018-10-30 |
Analysis Chip App 20180088081 - Kobayashi; Kentaro ;   et al. | 2018-03-29 |
Analysis package for detecting particles in a sample liquid including an analysis chip mounted on a package board Grant 9,885,680 - Hamasaki , et al. February 6, 2 | 2018-02-06 |
Analysis package for detecting particles in a sample liquid, and including shield layers Grant 9,770,714 - Hamasaki , et al. September 26, 2 | 2017-09-26 |
Particle Inspection System And Driving Method Employed Therein App 20170122859 - NISHIGAKI; Michihiko ;   et al. | 2017-05-04 |
Semiconductor Micro-analysis Chip And Method Of Manufacturing The Same App 20170122905 - KOBAYASHI; Kentaro ;   et al. | 2017-05-04 |
Semiconductor Analysis Chip And Particle Inspection Method App 20170074824 - KOBAYASHI; Kentaro ;   et al. | 2017-03-16 |
Analysis Package App 20160231263 - HAMASAKI; Hiroshi ;   et al. | 2016-08-11 |
Analysis Package App 20160231265 - HAMASAKI; Hiroshi ;   et al. | 2016-08-11 |
Analysis Package App 20160231262 - HAMASAKI; Hiroshi ;   et al. | 2016-08-11 |
Microanalysis Chip App 20160153935 - NISHIGAKI; Michihiko ;   et al. | 2016-06-02 |
Method for manufacturing semiconductor light emitting device Grant 9,306,141 - Hamasaki , et al. April 5, 2 | 2016-04-05 |
Method For Manufacturing Semiconductor Light Emitting Device App 20150303361 - Hamasaki; Hiroshi ;   et al. | 2015-10-22 |
Method for manufacturing semiconductor light emitting device Grant 9,105,828 - Hamasaki , et al. August 11, 2 | 2015-08-11 |
Method For Manufacturing Semiconductor Light Emitting Device App 20140329348 - Hamasaki; Hiroshi ;   et al. | 2014-11-06 |
Method for manufacturing semiconductor light emitting device Grant 8,852,976 - Hamasaki , et al. October 7, 2 | 2014-10-07 |
Light-Emitting Module Board and Manufacturing Method of the Light-Emitting Module Board App 20140183565 - UENO; Kousuke ;   et al. | 2014-07-03 |
Method For Manufacturing Semiconductor Light Emitting Device App 20140070264 - Hamasaki; Hiroshi ;   et al. | 2014-03-13 |
Method for manufacturing semiconductor light emitting device Grant 8,610,163 - Hamasaki , et al. December 17, 2 | 2013-12-17 |
Method For Manufacturing Semiconductor Light Emitting Device App 20120153344 - Hamasaki; Hiroshi ;   et al. | 2012-06-21 |
Method for manufacturing semiconductor light emitting device Grant 8,148,183 - Hamasaki , et al. April 3, 2 | 2012-04-03 |
Method For Manufacturing Semiconductor Light Emitting Device App 20110027921 - Hamasaki; Hiroshi ;   et al. | 2011-02-03 |
Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system Grant RE41,742 - Furuyama , et al. September 21, 2 | 2010-09-21 |
Optical module and manufacturing method of the same Grant 7,775,727 - Hamasaki , et al. August 17, 2 | 2010-08-17 |
Method of producing optical fiber positioning component, and optical fiber positioning component Grant 7,771,130 - Sakurai , et al. August 10, 2 | 2010-08-10 |
LSI package provided with interface module Grant 7,759,781 - Furuyama , et al. July 20, 2 | 2010-07-20 |
Optical transmission line holding member, optical module and mounting method thereof Grant 7,711,237 - Hamasaki , et al. May 4, 2 | 2010-05-04 |
LSI package with interface module and interface module Grant 7,667,982 - Hamasaki , et al. February 23, 2 | 2010-02-23 |
LSI package provided with interface module, and transmission line header employed in the package Grant 7,667,311 - Furuyama , et al. February 23, 2 | 2010-02-23 |
Interface module-mounted LSI package Grant 7,554,806 - Furuyama , et al. June 30, 2 | 2009-06-30 |
Method and apparatus for removing thin metal films Grant 7,544,283 - Daiku , et al. June 9, 2 | 2009-06-09 |
LSI package provided with interface module Grant 7,535,090 - Furuyama , et al. May 19, 2 | 2009-05-19 |
Optical Transmission Line Holding Member, Optical Module And Mounting Method Thereof App 20090103864 - HAMASAKI; Hiroshi ;   et al. | 2009-04-23 |
Lsi Package With Interface Module And Interface Module App 20090040739 - Hamasaki; Hiroshi ;   et al. | 2009-02-12 |
LSI package equipped with interface module, interface module and connection holding mechanism Grant 7,489,514 - Hamasaki , et al. February 10, 2 | 2009-02-10 |
Optical Module And Manufacturing Method Of The Same App 20080298745 - HAMASAKI; Hiroshi ;   et al. | 2008-12-04 |
Optical guide holding member and optical module Grant 7,441,964 - Hamasaki , et al. October 28, 2 | 2008-10-28 |
Optical semiconductor module and semiconductor device including the same Grant 7,438,481 - Numata , et al. October 21, 2 | 2008-10-21 |
Interface Module-mounted Lsi Package App 20080192433 - FURUYAMA; Hideto ;   et al. | 2008-08-14 |
LSI package provided with interface module, and transmission line header employed in the package Grant 7,411,282 - Furuyama , et al. August 12, 2 | 2008-08-12 |
Lsi Package Provided With Interface Module, And Transmission Line Header Employed In The Package App 20080185733 - Furuyama; Hideto ;   et al. | 2008-08-07 |
Method for manufacturing optical coupling part and optical coupling part Grant 7,401,983 - Sakurai , et al. July 22, 2 | 2008-07-22 |
LSI package provided with interface module and method of mounting the same Grant 7,394,665 - Hamasaki , et al. July 1, 2 | 2008-07-01 |
Method of producing optical fiber positioning component, and optical fiber positioning component App 20080138027 - Sakurai; Wataru ;   et al. | 2008-06-12 |
Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part Grant 7,364,369 - Sakurai , et al. April 29, 2 | 2008-04-29 |
Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system Grant 7,352,935 - Furuyama , et al. April 1, 2 | 2008-04-01 |
Interface module-mounted LSI package Grant 7,330,352 - Furuyama , et al. February 12, 2 | 2008-02-12 |
Optical fiber connector and connecting method Grant 7,314,317 - Hamasaki , et al. January 1, 2 | 2008-01-01 |
Interface module for connecting LSI packages, and LSI-incorporating apparatus Grant 7,312,520 - Furuyama , et al. December 25, 2 | 2007-12-25 |
Member holding optical transmission line and optical module Grant 7,300,213 - Hamasaki , et al. November 27, 2 | 2007-11-27 |
Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part App 20070212001 - Sakurai; Wataru ;   et al. | 2007-09-13 |
Optical semiconductor module and its manufacturing method Grant 7,255,493 - Hamasaki , et al. August 14, 2 | 2007-08-14 |
Method for manufacturing optical coupling part and optical coupling part App 20070165986 - Sakurai; Wataru ;   et al. | 2007-07-19 |
Optical Guide Holding Member And Optical Module App 20070081769 - Hamasaki; Hiroshi ;   et al. | 2007-04-12 |
Holder of optical transmission lines and multi-core optical wave-guide Grant 7,198,412 - Hamasaki , et al. April 3, 2 | 2007-04-03 |
Optical semiconductor module and method of manufacturing the same Grant 7,192,199 - Furuyama , et al. March 20, 2 | 2007-03-20 |
Semiconductor light-receiving device Grant 7,187,048 - Hamasaki March 6, 2 | 2007-03-06 |
Lsi Package Provided With Interface Module App 20070045868 - FURUYAMA; HIDETO ;   et al. | 2007-03-01 |
Member holding optical transmission line and optical module App 20060291783 - Hamasaki; Hiroshi ;   et al. | 2006-12-28 |
Interface module-mounted LSI package Grant 7,154,751 - Furuyama , et al. December 26, 2 | 2006-12-26 |
Interface module-mounted LSI package App 20060268522 - Furuyama; Hideto ;   et al. | 2006-11-30 |
Optical semiconductor module and its manufacturing method Grant 7,118,294 - Hamasaki , et al. October 10, 2 | 2006-10-10 |
Optical semiconductor module and its manufacturing method App 20060215969 - Hamasaki; Hiroshi ;   et al. | 2006-09-28 |
Interface module for connecting LSI packages, and LSI-incorporating apparatus App 20060192278 - Furuyama; Hideto ;   et al. | 2006-08-31 |
LSI package with interface module, transmission line package, and ribbon optical transmission line App 20060050493 - Hamasaki; Hiroshi ;   et al. | 2006-03-09 |
Optical semiconductor module and semiconductor device including the same App 20060045434 - Numata; Hideo ;   et al. | 2006-03-02 |
Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system App 20060039658 - Furuyama; Hideto ;   et al. | 2006-02-23 |
LSI package equipped with interface module, interface module and connection holding mechanism App 20060038287 - Hamasaki; Hiroshi ;   et al. | 2006-02-23 |
LSI package having interface function with exterior, circuit device including the same, and manufacturing method of circuit device App 20060035510 - Numata; Hideo ;   et al. | 2006-02-16 |
LSI package provided with interface module, and transmission line header employed in the package App 20050230795 - Furuyama, Hideto ;   et al. | 2005-10-20 |
Interface module-mounted LSI package App 20050231911 - Furuyama, Hideto ;   et al. | 2005-10-20 |
Optical fiber connector and connecting method App 20050213893 - Hamasaki, Hiroshi ;   et al. | 2005-09-29 |
Method and apparatus for removing thin metal films App 20050179023 - Daiku, Hiroyuki ;   et al. | 2005-08-18 |
Holder of optical transmission lines and multi-core optical wave-guide App 20050169596 - Hamasaki, Hiroshi ;   et al. | 2005-08-04 |
LSI package provided with interface module App 20050156304 - Furuyama, Hideto ;   et al. | 2005-07-21 |
Optical semiconductor module and method of manufacturing the same App 20050141824 - Furuyama, Hideto ;   et al. | 2005-06-30 |
Optical semiconductor module and its manufacturing method App 20050063651 - Hamasaki, Hiroshi ;   et al. | 2005-03-24 |
LSI package provided with interface module and method of mounting the same App 20040218372 - Hamasaki, Hiroshi ;   et al. | 2004-11-04 |
Semiconductor laser device Grant 6,687,272 - Hamasaki , et al. February 3, 2 | 2004-02-03 |
Semiconductor laser device Grant 6,654,393 - Hamasaki , et al. November 25, 2 | 2003-11-25 |
Semiconductor laser device App 20030053498 - Hamasaki, Hiroshi ;   et al. | 2003-03-20 |
Semiconductor laser device App 20020136256 - Hamasaki, Hiroshi ;   et al. | 2002-09-26 |
Semiconductor laser device Grant 6,449,296 - Hamasaki , et al. September 10, 2 | 2002-09-10 |
Disc playback system and display unit App 20020095531 - Mori, Toshiaki ;   et al. | 2002-07-18 |
Semiconductor light-receiving device App 20010050403 - Hamasaki, Hiroshi | 2001-12-13 |
Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer Grant 5,559,918 - Furuyama , et al. September 24, 1 | 1996-09-24 |
Optical interconnection device Grant 5,434,426 - Furuyama , et al. July 18, 1 | 1995-07-18 |
Optical semiconductor module Grant 5,412,748 - Furuyama , et al. May 2, 1 | 1995-05-02 |
Electronic parts mounting apparatus Grant 5,205,032 - Kuroda , et al. April 27, 1 | 1993-04-27 |