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name:-0.062712907791138
name:-0.062254190444946
name:-0.0062580108642578
HAMASAKI; Hiroshi Patent Filings

HAMASAKI; Hiroshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for HAMASAKI; Hiroshi.The latest application filed is for "gas concentration device, gas detection system, gas concentration method, and gas detection method".

Company Profile
5.47.50
  • HAMASAKI; Hiroshi - Hiratsuka Kanagawa JP
  • HAMASAKI; Hiroshi - Hiratsuka JP
  • Hamasaki; Hiroshi - Kanagawa-ken JP
  • HAMASAKI; Hiroshi - Kanagawa JP
  • Hamasaki; Hiroshi - Osaka JP
  • HAMASAKI; Hiroshi - Hiratsuka-shi JP
  • Hamasaki; Hiroshi - Tokyo JP
  • Hamasaki; Hiroshi - Sagamihara JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Gas Concentration Device, Gas Detection System, Gas Concentration Method, And Gas Detection Method
App 20220307952 - HAMASAKI; Hiroshi ;   et al.
2022-09-29
Chemical Sensor Module And Method For Detecting Hydrophobic Target Molecules
App 20220276200 - SUGIZAKI; Yoshiaki ;   et al.
2022-09-01
Analysis Chip
App 20210096099 - Kobayashi; Kentaro ;   et al.
2021-04-01
Particle inspection system and driving method employed therein
Grant 10,533,934 - Nishigaki , et al. Ja
2020-01-14
Microanalysis chip
Grant 10,337,976 - Nishigaki , et al.
2019-07-02
Semiconductor micro-analysis chip and method of manufacturing the same
Grant 10,281,429 - Kobayashi , et al.
2019-05-07
Detection Device, Detection Method, And Electrode With Probe
App 20190064157 - MIYAGAWA; Takuya ;   et al.
2019-02-28
Semiconductor analysis chip and particle inspection method
Grant 10,113,947 - Kobayashi , et al. October 30, 2
2018-10-30
Analysis Chip
App 20180088081 - Kobayashi; Kentaro ;   et al.
2018-03-29
Analysis package for detecting particles in a sample liquid including an analysis chip mounted on a package board
Grant 9,885,680 - Hamasaki , et al. February 6, 2
2018-02-06
Analysis package for detecting particles in a sample liquid, and including shield layers
Grant 9,770,714 - Hamasaki , et al. September 26, 2
2017-09-26
Particle Inspection System And Driving Method Employed Therein
App 20170122859 - NISHIGAKI; Michihiko ;   et al.
2017-05-04
Semiconductor Micro-analysis Chip And Method Of Manufacturing The Same
App 20170122905 - KOBAYASHI; Kentaro ;   et al.
2017-05-04
Semiconductor Analysis Chip And Particle Inspection Method
App 20170074824 - KOBAYASHI; Kentaro ;   et al.
2017-03-16
Analysis Package
App 20160231263 - HAMASAKI; Hiroshi ;   et al.
2016-08-11
Analysis Package
App 20160231265 - HAMASAKI; Hiroshi ;   et al.
2016-08-11
Analysis Package
App 20160231262 - HAMASAKI; Hiroshi ;   et al.
2016-08-11
Microanalysis Chip
App 20160153935 - NISHIGAKI; Michihiko ;   et al.
2016-06-02
Method for manufacturing semiconductor light emitting device
Grant 9,306,141 - Hamasaki , et al. April 5, 2
2016-04-05
Method For Manufacturing Semiconductor Light Emitting Device
App 20150303361 - Hamasaki; Hiroshi ;   et al.
2015-10-22
Method for manufacturing semiconductor light emitting device
Grant 9,105,828 - Hamasaki , et al. August 11, 2
2015-08-11
Method For Manufacturing Semiconductor Light Emitting Device
App 20140329348 - Hamasaki; Hiroshi ;   et al.
2014-11-06
Method for manufacturing semiconductor light emitting device
Grant 8,852,976 - Hamasaki , et al. October 7, 2
2014-10-07
Light-Emitting Module Board and Manufacturing Method of the Light-Emitting Module Board
App 20140183565 - UENO; Kousuke ;   et al.
2014-07-03
Method For Manufacturing Semiconductor Light Emitting Device
App 20140070264 - Hamasaki; Hiroshi ;   et al.
2014-03-13
Method for manufacturing semiconductor light emitting device
Grant 8,610,163 - Hamasaki , et al. December 17, 2
2013-12-17
Method For Manufacturing Semiconductor Light Emitting Device
App 20120153344 - Hamasaki; Hiroshi ;   et al.
2012-06-21
Method for manufacturing semiconductor light emitting device
Grant 8,148,183 - Hamasaki , et al. April 3, 2
2012-04-03
Method For Manufacturing Semiconductor Light Emitting Device
App 20110027921 - Hamasaki; Hiroshi ;   et al.
2011-02-03
Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system
Grant RE41,742 - Furuyama , et al. September 21, 2
2010-09-21
Optical module and manufacturing method of the same
Grant 7,775,727 - Hamasaki , et al. August 17, 2
2010-08-17
Method of producing optical fiber positioning component, and optical fiber positioning component
Grant 7,771,130 - Sakurai , et al. August 10, 2
2010-08-10
LSI package provided with interface module
Grant 7,759,781 - Furuyama , et al. July 20, 2
2010-07-20
Optical transmission line holding member, optical module and mounting method thereof
Grant 7,711,237 - Hamasaki , et al. May 4, 2
2010-05-04
LSI package with interface module and interface module
Grant 7,667,982 - Hamasaki , et al. February 23, 2
2010-02-23
LSI package provided with interface module, and transmission line header employed in the package
Grant 7,667,311 - Furuyama , et al. February 23, 2
2010-02-23
Interface module-mounted LSI package
Grant 7,554,806 - Furuyama , et al. June 30, 2
2009-06-30
Method and apparatus for removing thin metal films
Grant 7,544,283 - Daiku , et al. June 9, 2
2009-06-09
LSI package provided with interface module
Grant 7,535,090 - Furuyama , et al. May 19, 2
2009-05-19
Optical Transmission Line Holding Member, Optical Module And Mounting Method Thereof
App 20090103864 - HAMASAKI; Hiroshi ;   et al.
2009-04-23
Lsi Package With Interface Module And Interface Module
App 20090040739 - Hamasaki; Hiroshi ;   et al.
2009-02-12
LSI package equipped with interface module, interface module and connection holding mechanism
Grant 7,489,514 - Hamasaki , et al. February 10, 2
2009-02-10
Optical Module And Manufacturing Method Of The Same
App 20080298745 - HAMASAKI; Hiroshi ;   et al.
2008-12-04
Optical guide holding member and optical module
Grant 7,441,964 - Hamasaki , et al. October 28, 2
2008-10-28
Optical semiconductor module and semiconductor device including the same
Grant 7,438,481 - Numata , et al. October 21, 2
2008-10-21
Interface Module-mounted Lsi Package
App 20080192433 - FURUYAMA; Hideto ;   et al.
2008-08-14
LSI package provided with interface module, and transmission line header employed in the package
Grant 7,411,282 - Furuyama , et al. August 12, 2
2008-08-12
Lsi Package Provided With Interface Module, And Transmission Line Header Employed In The Package
App 20080185733 - Furuyama; Hideto ;   et al.
2008-08-07
Method for manufacturing optical coupling part and optical coupling part
Grant 7,401,983 - Sakurai , et al. July 22, 2
2008-07-22
LSI package provided with interface module and method of mounting the same
Grant 7,394,665 - Hamasaki , et al. July 1, 2
2008-07-01
Method of producing optical fiber positioning component, and optical fiber positioning component
App 20080138027 - Sakurai; Wataru ;   et al.
2008-06-12
Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part
Grant 7,364,369 - Sakurai , et al. April 29, 2
2008-04-29
Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system
Grant 7,352,935 - Furuyama , et al. April 1, 2
2008-04-01
Interface module-mounted LSI package
Grant 7,330,352 - Furuyama , et al. February 12, 2
2008-02-12
Optical fiber connector and connecting method
Grant 7,314,317 - Hamasaki , et al. January 1, 2
2008-01-01
Interface module for connecting LSI packages, and LSI-incorporating apparatus
Grant 7,312,520 - Furuyama , et al. December 25, 2
2007-12-25
Member holding optical transmission line and optical module
Grant 7,300,213 - Hamasaki , et al. November 27, 2
2007-11-27
Lead frame, optical coupling part using lead frame, and manufacturing method of optical coupling part
App 20070212001 - Sakurai; Wataru ;   et al.
2007-09-13
Optical semiconductor module and its manufacturing method
Grant 7,255,493 - Hamasaki , et al. August 14, 2
2007-08-14
Method for manufacturing optical coupling part and optical coupling part
App 20070165986 - Sakurai; Wataru ;   et al.
2007-07-19
Optical Guide Holding Member And Optical Module
App 20070081769 - Hamasaki; Hiroshi ;   et al.
2007-04-12
Holder of optical transmission lines and multi-core optical wave-guide
Grant 7,198,412 - Hamasaki , et al. April 3, 2
2007-04-03
Optical semiconductor module and method of manufacturing the same
Grant 7,192,199 - Furuyama , et al. March 20, 2
2007-03-20
Semiconductor light-receiving device
Grant 7,187,048 - Hamasaki March 6, 2
2007-03-06
Lsi Package Provided With Interface Module
App 20070045868 - FURUYAMA; HIDETO ;   et al.
2007-03-01
Member holding optical transmission line and optical module
App 20060291783 - Hamasaki; Hiroshi ;   et al.
2006-12-28
Interface module-mounted LSI package
Grant 7,154,751 - Furuyama , et al. December 26, 2
2006-12-26
Interface module-mounted LSI package
App 20060268522 - Furuyama; Hideto ;   et al.
2006-11-30
Optical semiconductor module and its manufacturing method
Grant 7,118,294 - Hamasaki , et al. October 10, 2
2006-10-10
Optical semiconductor module and its manufacturing method
App 20060215969 - Hamasaki; Hiroshi ;   et al.
2006-09-28
Interface module for connecting LSI packages, and LSI-incorporating apparatus
App 20060192278 - Furuyama; Hideto ;   et al.
2006-08-31
LSI package with interface module, transmission line package, and ribbon optical transmission line
App 20060050493 - Hamasaki; Hiroshi ;   et al.
2006-03-09
Optical semiconductor module and semiconductor device including the same
App 20060045434 - Numata; Hideo ;   et al.
2006-03-02
Optoelectronic conversion header, LSI package with interface module, method of manufacturing optoelectronic conversion header, and optical interconnection system
App 20060039658 - Furuyama; Hideto ;   et al.
2006-02-23
LSI package equipped with interface module, interface module and connection holding mechanism
App 20060038287 - Hamasaki; Hiroshi ;   et al.
2006-02-23
LSI package having interface function with exterior, circuit device including the same, and manufacturing method of circuit device
App 20060035510 - Numata; Hideo ;   et al.
2006-02-16
LSI package provided with interface module, and transmission line header employed in the package
App 20050230795 - Furuyama, Hideto ;   et al.
2005-10-20
Interface module-mounted LSI package
App 20050231911 - Furuyama, Hideto ;   et al.
2005-10-20
Optical fiber connector and connecting method
App 20050213893 - Hamasaki, Hiroshi ;   et al.
2005-09-29
Method and apparatus for removing thin metal films
App 20050179023 - Daiku, Hiroyuki ;   et al.
2005-08-18
Holder of optical transmission lines and multi-core optical wave-guide
App 20050169596 - Hamasaki, Hiroshi ;   et al.
2005-08-04
LSI package provided with interface module
App 20050156304 - Furuyama, Hideto ;   et al.
2005-07-21
Optical semiconductor module and method of manufacturing the same
App 20050141824 - Furuyama, Hideto ;   et al.
2005-06-30
Optical semiconductor module and its manufacturing method
App 20050063651 - Hamasaki, Hiroshi ;   et al.
2005-03-24
LSI package provided with interface module and method of mounting the same
App 20040218372 - Hamasaki, Hiroshi ;   et al.
2004-11-04
Semiconductor laser device
Grant 6,687,272 - Hamasaki , et al. February 3, 2
2004-02-03
Semiconductor laser device
Grant 6,654,393 - Hamasaki , et al. November 25, 2
2003-11-25
Semiconductor laser device
App 20030053498 - Hamasaki, Hiroshi ;   et al.
2003-03-20
Semiconductor laser device
App 20020136256 - Hamasaki, Hiroshi ;   et al.
2002-09-26
Semiconductor laser device
Grant 6,449,296 - Hamasaki , et al. September 10, 2
2002-09-10
Disc playback system and display unit
App 20020095531 - Mori, Toshiaki ;   et al.
2002-07-18
Semiconductor light-receiving device
App 20010050403 - Hamasaki, Hiroshi
2001-12-13
Optical semiconductor module in which a hermetically sealed optical semiconductor device is connected to an electrical wiring layer
Grant 5,559,918 - Furuyama , et al. September 24, 1
1996-09-24
Optical interconnection device
Grant 5,434,426 - Furuyama , et al. July 18, 1
1995-07-18
Optical semiconductor module
Grant 5,412,748 - Furuyama , et al. May 2, 1
1995-05-02
Electronic parts mounting apparatus
Grant 5,205,032 - Kuroda , et al. April 27, 1
1993-04-27

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