| Patent | Date |
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Compression coil spring and manufacturing device and manufacturing method for coil spring
Grant 8,695,956 - Hamano , et al. April 15, 2 | 2014-04-15 |
Compression Coil Spring And Manufacturing Device And Manufacturing Method For Coil Spring
App 20120013059 - Hamano; Toshio ; et al. | 2012-01-19 |
Compression coil spring device having a discrete support
Grant 7,963,510 - Umezawa , et al. June 21, 2 | 2011-06-21 |
Compression coil spring device having a discrete support
App 20070176340 - Umezawa; Masahiro ; et al. | 2007-08-02 |
Semiconductor device having a heat spreader exposed from a seal resin
App 20070114642 - Hosoyamada; Sumikazu ; et al. | 2007-05-24 |
Semiconductor device having a heat spreader exposed from a seal resin
Grant 7,193,320 - Hosoyamada , et al. March 20, 2 | 2007-03-20 |
Compression coil spring device having discontinuous support structure
App 20050051937 - Umezawa, Masahiro ; et al. | 2005-03-10 |
Semiconductor module including a plurality of semiconductor devices detachably
Grant 6,696,754 - Sato , et al. February 24, 2 | 2004-02-24 |
Semiconductor device having a heat spreader exposed from a seal resin
App 20030222344 - Hosoyamada, Sumikazu ; et al. | 2003-12-04 |
Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
Grant 6,627,479 - Aiba , et al. September 30, 2 | 2003-09-30 |
Semiconductor module including a plurality of semiconductor devices detachably
App 20030164544 - Sato, Mitsutaka ; et al. | 2003-09-04 |
Semiconductor device, method of producing semiconductor device and semiconductor device mounting structure
Grant 6,462,424 - Seki , et al. October 8, 2 | 2002-10-08 |
Apparatus for a vertically accumulable semiconductor device with external leads secured by a positioning mechanism
Grant 6,433,418 - Fujisawa , et al. August 13, 2 | 2002-08-13 |
Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
App 20020050639 - Aiba, Yoshitaka ; et al. | 2002-05-02 |
Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer
Grant 6,348,728 - Aiba , et al. February 19, 2 | 2002-02-19 |
Semiconductor device and method of forming the same
Grant 6,347,037 - Iijima , et al. February 12, 2 | 2002-02-12 |
Semiconductor Module Including A Plurality Of Semiconductor Devices Detachably
App 20020000645 - SATO, MITSUTAKA ; et al. | 2002-01-03 |
Semiconductor Device And Method Of Forming The Same.
App 20020001178 - IIJIMA, MAKOTO ; et al. | 2002-01-03 |
Surface mount type semiconductor device and method of producing the same having an interposing layer electrically connecting the semiconductor chip with protrusion electrodes
Grant 6,333,564 - Katoh , et al. December 25, 2 | 2001-12-25 |
Semiconductor device and method of producing the same
App 20010052653 - Abe, Mitsuo ; et al. | 2001-12-20 |
Semiconductor device and method of producing the same
Grant 6,288,444 - Abe , et al. September 11, 2 | 2001-09-11 |
LSI package with equal length transmission Lines
Grant 6,235,997 - Asada , et al. May 22, 2 | 2001-05-22 |
Semiconductor unit having semiconductor device and multilayer substrate, in which grounding conductors surround conductors used for signal and power
Grant 5,923,540 - Asada , et al. July 13, 1 | 1999-07-13 |
Process for manufacturing a packaged semiconductor having a divided leadframe stage
Grant 5,804,468 - Tsuji , et al. September 8, 1 | 1998-09-08 |
Semiconductor device and assembly board having through-holes filled with filling core
Grant 5,729,435 - Iijima , et al. March 17, 1 | 1998-03-17 |
Semiconductor device and lead frame therefore
Grant 5,497,032 - Tsuji , et al. March 5, 1 | 1996-03-05 |
Semiconductor device having improved adhesive structure and method of producing same
Grant 5,278,429 - Takenaka , et al. January 11, 1 | 1994-01-11 |
Semiconductor device having soldered bond between base and cap thereof
Grant 4,626,960 - Hamano , et al. December 2, 1 | 1986-12-02 |
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