Hamanaka; Masashi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hamanaka; Masashi.The latest application filed is for "polishing method for semiconductor device, method for fabricating semiconductor device and polishing system".
- Hamanaka; Masashi - Nara JP
| Patent | Date |
|---|---|
| Method for forming wiring structure Grant 6,919,267 - Ueda , et al. July 19, 2 | 2005-07-19 |
| Method for forming wiring structure Grant 6,881,660 - Harada , et al. April 19, 2 | 2005-04-19 |
| Method for forming wiring structure Grant 6,858,549 - Hamanaka , et al. February 22, 2 | 2005-02-22 |
| Method for forming wiring structure Grant 6,759,322 - Yoshida , et al. July 6, 2 | 2004-07-06 |
| Polishing method for semiconductor device, method for fabricating semiconductor device and polishing system App 20040127148 - Hamanaka, Masashi ; et al. | 2004-07-01 |
| Method for polishing semiconductor wafer and polishing pad for the same App 20040097174 - Shirakashi, Eigo ; et al. | 2004-05-20 |
| Method for forming buried interconnect Grant 6,737,348 - Satake , et al. May 18, 2 | 2004-05-18 |
| Method for forming wiring structure App 20040009653 - Ueda, Tetsuya ; et al. | 2004-01-15 |
| Method for forming wiring structure App 20030224594 - Yoshida, Hideaki ; et al. | 2003-12-04 |
| Method for forming wiring structure App 20030216033 - Harada, Takeshi ; et al. | 2003-11-20 |
| Method for forming wiring structure App 20030216019 - Hamanaka, Masashi ; et al. | 2003-11-20 |
| Apparatus and method for chemical/mechanical polishing Grant 6,416,617 - Yoshida , et al. July 9, 2 | 2002-07-09 |
| Method for forming metallic plug Grant 6,248,660 - Hamanaka , et al. June 19, 2 | 2001-06-19 |
| Apparatus and method for chemical/mechanical polishing App 20010000753 - Yoshida, Hideaki ; et al. | 2001-05-03 |
| Apparatus and method for chemical/mechanical polishing Grant 6,191,038 - Yoshida , et al. February 20, 2 | 2001-02-20 |
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