Patent | Date |
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Heat-curable resin composition and semiconductor device Grant 11,059,973 - Tsutsumi , et al. July 13, 2 | 2021-07-13 |
Heat-curable resin composition for semiconductor encapsulation and semiconductor device Grant 11,046,848 - Tsutsumi , et al. June 29, 2 | 2021-06-29 |
Heat-curable resin composition for semiconductor encapsulation and semiconductor device Grant 11,001,704 - Tsutsumi , et al. May 11, 2 | 2021-05-11 |
Heat-curable resin composition, heat-curable resin film and semiconductor device Grant 10,865,304 - Kushihara , et al. December 15, 2 | 2020-12-15 |
Substrate and semiconductor apparatus Grant 10,743,412 - Akahane , et al. A | 2020-08-11 |
Surface-modified glass fiber film Grant 10,669,197 - Akahane , et al. | 2020-06-02 |
Heat-curable Resin Composition, Heat-curable Resin Film And Semiconductor Device App 20200079954 - KUSHIHARA; Naoyuki ;   et al. | 2020-03-12 |
Heat-curable Resin Composition For Semiconductor Encapsulation And Semiconductor Device App 20200048455 - TSUTSUMI; Yoshihiro ;   et al. | 2020-02-13 |
Heat-curable Resin Composition And Semiconductor Device App 20200048464 - TSUTSUMI; Yoshihiro ;   et al. | 2020-02-13 |
Heat-curable Maleimide Resin Composition For Semiconductor Encapsulation And Semiconductor Device App 20190355638 - Tsutsumi; Yoshihiro ;   et al. | 2019-11-21 |
Quartz Glass Fiber-containing Prepreg And Quartz Glass Fiber-containing Substrate App 20190338094 - HAMAMOTO; Yoshihira ;   et al. | 2019-11-07 |
Quartz Glass Fiber-containing Prepreg, Quartz Glass Fiber-containing Film And Quartz Glass Fiber-containing Substrate App 20190225762 - TSUTSUMI; Yoshihiro ;   et al. | 2019-07-25 |
Silicone Resin Transparent Substrate And Method For Manufacturing The Same App 20180057648 - KIMURA; Saiko ;   et al. | 2018-03-01 |
Silicone Resin Substrate, Metal Layer-formed Silicone Resin Substrate, Cured Silicone Resin Substrate, And Metal Layer-formed Cured-silicone Resin Substrate App 20180057638 - KIMURA; Saiko ;   et al. | 2018-03-01 |
Addition/condensation curable silicone resin sheet, wavelength conversion sheet, and manufacture of light-emitting package Grant 9,902,856 - Kusunoki , et al. February 27, 2 | 2018-02-27 |
Method for producing surface-treated glass fiber film and flexible fiber substrate Grant 9,902,649 - Hamamoto , et al. February 27, 2 | 2018-02-27 |
Addition/condensation Curable Silicone Resin Sheet, Wavelength Conversion Sheet, And Manufacture Of Light-emitting Package App 20170114220 - KUSUNOKI; Takayuki ;   et al. | 2017-04-27 |
Printed Wiring Board, Method For Producing Printed Wiring Board And Semiconductor Device App 20160322293 - KIMURA; Saiko ;   et al. | 2016-11-03 |
Optical semiconductor device Grant 9,306,133 - Hamamoto , et al. April 5, 2 | 2016-04-05 |
Method For Producing Surface-treated Glass Fiber Film And Flexible Fiber Substrate App 20150315073 - HAMAMOTO; Yoshihira ;   et al. | 2015-11-05 |
Substrate And Semiconductor Apparatus App 20150245476 - AKAHANE; Saiko ;   et al. | 2015-08-27 |
Silicone resin composition and an optical semiconductor device Grant 9,117,985 - Hamamoto , et al. August 25, 2 | 2015-08-25 |
Surface-modified Glass Fiber Film App 20150197885 - AKAHANE; Saiko ;   et al. | 2015-07-16 |
Silicone Resin Composition And An Optical Semiconductor Device App 20150144987 - HAMAMOTO; Yoshihira ;   et al. | 2015-05-28 |
Thermosetting silicone resin composition for reflector of LED, reflector for LED using the same and optical semiconductor apparatus Grant 8,933,158 - Shiobara , et al. January 13, 2 | 2015-01-13 |
Cycloalkyl group-containing silicone resin composition and a method of using the same Grant 8,889,809 - Hamamoto , et al. November 18, 2 | 2014-11-18 |
Low gas permeable silicone resin composition and optoelectronic device Grant 8,614,282 - Hamamoto , et al. December 24, 2 | 2013-12-24 |
Silicone Resin Composition And An Optical Semiconductor Device Provided With A Cured Product Obtained By Curing The Same App 20130331499 - HAMAMOTO; Yoshihira ;   et al. | 2013-12-12 |
High adhesiveness silicone resin composition and an optical semiconductor device provided with a cured product thereof Grant 8,598,282 - Hamamoto , et al. December 3, 2 | 2013-12-03 |
Curable silicone resin composition with high reliability and optical semiconductor device using same Grant 8,569,429 - Hamamoto , et al. October 29, 2 | 2013-10-29 |
Thermosetting Silicone Resin Composition For Reflector Of Led, Reflector For Led Using The Same And Optical Semiconductor Apparatus App 20130274398 - SHIOBARA; Toshio ;   et al. | 2013-10-17 |
Silicone resin composition and optical semiconductor device using the composition Grant 8,481,656 - Kashiwagi , et al. July 9, 2 | 2013-07-09 |
Curable Silicone Resin Composition With High Reliability And Optical Semiconductor Device Using Same App 20130161683 - Hamamoto; Yoshihira ;   et al. | 2013-06-27 |
Silicone resin composition and an optical semiconductor device making use of the composition Grant 8,431,953 - Hamamoto , et al. April 30, 2 | 2013-04-30 |
Optical Semiconductor Device App 20130056786 - HAMAMOTO; Yoshihira ;   et al. | 2013-03-07 |
Silicone Resin Composition And Optical Semiconductor Device Using The Composition App 20120256325 - KASHIWAGI; Tsutomu ;   et al. | 2012-10-11 |
Silicone Resin Composition And An Optical Semiconductor Device Making Use Of The Composition App 20120184663 - HAMAMOTO; Yoshihira ;   et al. | 2012-07-19 |
Resin composition for encapsulating optical semiconductor element Grant 8,133,957 - Hamamoto , et al. March 13, 2 | 2012-03-13 |
Low Gas Permeable Silicone Resin Composition And Optoelectronic Device App 20120056236 - HAMAMOTO; Yoshihira ;   et al. | 2012-03-08 |
Cycloalkyl Group-containing Silicone Resin Composition And A Method Of Using The Same App 20110309407 - HAMAMOTO; Yoshihira ;   et al. | 2011-12-22 |
High Adhesiveness Silicone Resin Composition And An Optical Semiconductor Device Provided With A Cured Product Thereof App 20110269918 - HAMAMOTO; Yoshihira ;   et al. | 2011-11-03 |
Resin Composition For Encapsulating Optical Semiconductor Element App 20100029887 - Hamamoto; Yoshihira ;   et al. | 2010-02-04 |