Hamajima; Tomoki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hamajima; Tomoki.The latest application filed is for "resin composition, prepreg, laminate, metal foil-clad laminate, printed wiring board, and multilayer printed wiring board".

Company Profile

5.7.8

Hamajima; Tomoki - Shinagawa-ku JP
Hamajima; Tomoki - Tokyo JP
Hamajima; Tomoki - Katsushika-ku JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Information processing apparatus, information processing method, and program Grant 10,976,648 - Saito , et al. April 13, 2	2021-04-13
Control device, control method, and program Grant 10,955,960 - Saito , et al. March 23, 2	2021-03-23
Resin composition, prepreg, resin sheet, metal foil-clad laminate, and printed circuit board Grant 10,815,349 - Tomizawa , et al. October 27, 2	2020-10-27
Resin Composition, Prepreg, Laminate, Metal Foil-clad Laminate, Printed Wiring Board, And Multilayer Printed Wiring Board App 20200325292 - HAMAJIMA; Tomoki ; et al.	2020-10-15
Prepreg, metal foil-clad laminate, and printed wiring board Grant 10,791,626 - Hamajima , et al. September 29, 2	2020-09-29
Resin composition, prepreg, metal foil-clad laminate, and printed circuit board Grant 10,550,228 - Kashima , et al. Fe	2020-02-04
Information Processing Apparatus, Information Processing Method, And Program App 20190310538 - SAITO; Yuichiro ; et al.	2019-10-10
Resin Composition, Prepreg, Metal Foil-clad Laminate, And Printed Circuit Board App 20180186933 - KASHIMA; Naoki ; et al.	2018-07-05
Resin Composition, Prepreg, Resin Sheet, Metal Foil-clad Laminate, And Printed Circuit Board App 20180179355 - TOMIZAWA; Katsuya ; et al.	2018-06-28
Control Device, Control Method, And Program App 20170244943 - SAITO; Yuichiro ; et al.	2017-08-24
Resin composition, prepreg, and laminate Grant 9,512,329 - Nobukuni , et al. December 6, 2	2016-12-06
Prepreg, Metal Foil-clad Laminate, And Printed Circuit Board App 20160219700 - HAMAJIMA; Tomoki ; et al.	2016-07-28
Resin Composition, Prepreg, And Laminate App 20140227924 - Nobukuni; Takeshi ; et al.	2014-08-14

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