loadpatents
name:-0.0048811435699463
name:-0.006289005279541
name:-0.00060391426086426
Hamada; Yoshiki Patent Filings

Hamada; Yoshiki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hamada; Yoshiki.The latest application filed is for "circuit board".

Company Profile
0.11.10
  • Hamada; Yoshiki - Tokyo JP
  • Hamada; Yoshiki - Takasaki JP
  • Hamada; Yoshiki - Takasaki-shi JP
  • Hamada; Yoshiki - Aichi-gun Aichi Prefecture JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Circuit board
Grant 10,957,652 - Sugiyama , et al. March 23, 2
2021-03-23
Circuit Board
App 20200185332 - SUGIYAMA; Yuichi ;   et al.
2020-06-11
Semiconductor module
Grant 10,607,940 - Sugiyama , et al.
2020-03-31
Semiconductor Module
App 20190051608 - SUGIYAMA; Yuichi ;   et al.
2019-02-14
Communication module
Grant 9,713,259 - Hamada , et al. July 18, 2
2017-07-18
Multilayer circuit substrate having core layer with through-hole
Grant 9,560,743 - Hamada , et al. January 31, 2
2017-01-31
Substrate for embedding imaging device and method for manufacturing same, and imaging apparatus
Grant 9,484,372 - Sugiyama , et al. November 1, 2
2016-11-01
Substrate For Embedding Imaging Device And Method For Manufacturing Same, And Imaging Apparatus
App 20160163751 - SUGIYAMA; Yuichi ;   et al.
2016-06-09
Communication Module
App 20150282328 - HAMADA; Yoshiki ;   et al.
2015-10-01
Substrate with built-in electronic component
Grant 9,078,370 - Sugiyama , et al. July 7, 2
2015-07-07
Electronic circuit module and method for producing the same
Grant 8,988,885 - Sawatari , et al. March 24, 2
2015-03-24
Electronic component to be embedded in substrate and component-embedded substrate
Grant 8,791,783 - Miyazaki , et al. July 29, 2
2014-07-29
Multilayer Circuit Substrate
App 20140144692 - HAMADA; Yoshiki ;   et al.
2014-05-29
Electronic Circuit Module And Method For Producing The Same
App 20140126157 - SAWATARI; Tatsuro ;   et al.
2014-05-08
Substrate With Built-in Electronic Component
App 20140048321 - Sugiyama; Yuichi ;   et al.
2014-02-20
Electronic Component To Be Embedded In Substrate And Component-embedded Substrate
App 20130200977 - Miyazaki; Masashi ;   et al.
2013-08-08
Halo-salicylanilide
Grant 4,310,682 - Ozawa , et al. January 12, 1
1982-01-12

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