loadpatents
Patent applications and USPTO patent grants for Hamada; Yoshiki.The latest application filed is for "circuit board".
Patent | Date |
---|---|
Circuit board Grant 10,957,652 - Sugiyama , et al. March 23, 2 | 2021-03-23 |
Circuit Board App 20200185332 - SUGIYAMA; Yuichi ;   et al. | 2020-06-11 |
Semiconductor module Grant 10,607,940 - Sugiyama , et al. | 2020-03-31 |
Semiconductor Module App 20190051608 - SUGIYAMA; Yuichi ;   et al. | 2019-02-14 |
Communication module Grant 9,713,259 - Hamada , et al. July 18, 2 | 2017-07-18 |
Multilayer circuit substrate having core layer with through-hole Grant 9,560,743 - Hamada , et al. January 31, 2 | 2017-01-31 |
Substrate for embedding imaging device and method for manufacturing same, and imaging apparatus Grant 9,484,372 - Sugiyama , et al. November 1, 2 | 2016-11-01 |
Substrate For Embedding Imaging Device And Method For Manufacturing Same, And Imaging Apparatus App 20160163751 - SUGIYAMA; Yuichi ;   et al. | 2016-06-09 |
Communication Module App 20150282328 - HAMADA; Yoshiki ;   et al. | 2015-10-01 |
Substrate with built-in electronic component Grant 9,078,370 - Sugiyama , et al. July 7, 2 | 2015-07-07 |
Electronic circuit module and method for producing the same Grant 8,988,885 - Sawatari , et al. March 24, 2 | 2015-03-24 |
Electronic component to be embedded in substrate and component-embedded substrate Grant 8,791,783 - Miyazaki , et al. July 29, 2 | 2014-07-29 |
Multilayer Circuit Substrate App 20140144692 - HAMADA; Yoshiki ;   et al. | 2014-05-29 |
Electronic Circuit Module And Method For Producing The Same App 20140126157 - SAWATARI; Tatsuro ;   et al. | 2014-05-08 |
Substrate With Built-in Electronic Component App 20140048321 - Sugiyama; Yuichi ;   et al. | 2014-02-20 |
Electronic Component To Be Embedded In Substrate And Component-embedded Substrate App 20130200977 - Miyazaki; Masashi ;   et al. | 2013-08-08 |
Halo-salicylanilide Grant 4,310,682 - Ozawa , et al. January 12, 1 | 1982-01-12 |
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