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name:-0.004410982131958
name:-0.0044610500335693
name:-0.0014059543609619
Hamada; Yorihisa Patent Filings

Hamada; Yorihisa

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hamada; Yorihisa.The latest application filed is for "coupler".

Company Profile
0.2.3
  • Hamada; Yorihisa - Kanagawa JP
  • Hamada; Yorihisa - Yokohama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Coupler
App 20100186836 - Yoshihiro; Kenji ;   et al.
2010-07-29
Multi-layered preform and multi-layered bottle manufactured by using the same
Grant 6,929,836 - Kikuchi , et al. August 16, 2
2005-08-16
Multi-layered preform and multi-layered bottle manufactured by using the same
App 20040091652 - Kikuchi, Atsushi ;   et al.
2004-05-13
Multi-layered preform and multi-layered bottle manufactured by using the same
App 20020098310 - Kikuchi, Atsushi ;   et al.
2002-07-25
Stretched molded structure and a process for its production
Grant 5,409,750 - Hamada , et al. April 25, 1
1995-04-25

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