Hamada; Mitsuyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hamada; Mitsuyoshi.The latest application filed is for "epoxy resin molding material for sealing and electronic component device".

Company Profile

1.7.10

Hamada; Mitsuyoshi - Tsukuba JP
Hamada; Mitsuyoshi - Abiko JP
Hamada; Mitsuyoshi - Tsukuba-shi JP
Hamada; Mitsuyoshi - Abiko-shi JP
Hamada; Mitsuyoshi - Chiba JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Epoxy resin molding material for sealing and electronic component device Grant 10,662,315 - Hamada , et al.	2020-05-26
Optical semiconductor element mounting substrate and optical semiconductor device using thermosetting resin composition for light reflection Grant 10,381,533 - Kotani , et al. A	2019-08-13
Epoxy Resin Molding Material For Sealing And Electronic Component Device App 20170121505 - Hamada; Mitsuyoshi ; et al.	2017-05-04
Optical Semiconductor Element Mounting Substrate And Optical Semiconductor Device Using Thermosetting Resin Composition For Light Reflection App 20170040513 - Kotani; Hayato ; et al.	2017-02-09
Thermosetting resin composition for light reflection, method for manufacturing the resin composition and optical semiconductor element mounting substrate and optical semiconductor device using the resin composition Grant 9,387,608 - Kotani , et al. July 12, 2	2016-07-12
Epoxy Resin Molding Material For Sealing And Electronic Component Device App 20140128505 - Hamada; Mitsuyoshi ; et al.	2014-05-08
Epoxy resin molding material for sealing and electronic component device Grant 8,084,130 - Hamada , et al. December 27, 2	2011-12-27
Nitrogen-containing organosilicon compound method of manufacture, and method of treating surfaces Grant 7,838,671 - Iwai , et al. November 23, 2	2010-11-23
Thermosetting Resin Composition For Light Reflection, Method For Manufacturing The Resin Composition And Optical Semiconductor Element Mounting Substrate And Optical Semiconductor Device Using The Resin Composition App 20100140638 - Kotani; Hayato ; et al.	2010-06-10
Epoxy Resin Molding Material For Sealing And Electronic Component Device App 20090326100 - Hamada; Mitsuyoshi ; et al.	2009-12-31
Epoxy Resin Molding Material for Sealing, and Electronic Component Device App 20090247670 - Hamada; Mitsuyoshi ; et al.	2009-10-01
Epoxy Resin Molding Material for Sealing and Electronic Component Device App 20090012233 - Hamada; Mitsuyoshi ; et al.	2009-01-08
Nitrogen-Containing Organosilicon Compound Method Of Manufacture, And Method Of Treating Surfaces App 20080177065 - Iwai; Makoto ; et al.	2008-07-24
Nitrogen-containing organosilicon compound, method of manufacture, and method of treating surfaces Grant 7,326,800 - Iwai , et al. February 5, 2	2008-02-05
Nitrogen-containing organosilicon compound, method of manufacture, and method of treating surfaces App 20060287546 - Iwai; Makoto ; et al.	2006-12-21

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