loadpatents
name:-0.026525020599365
name:-0.016422033309937
name:-0.00047206878662109
Hamada; Kunihiko Patent Filings

Hamada; Kunihiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hamada; Kunihiko.The latest application filed is for "method for manufacturing laminated coil component".

Company Profile
0.12.16
  • Hamada; Kunihiko - Nagaokakyo JP
  • HAMADA; Kunihiko - Kyoto-fu JP
  • HAMADA; Kunihiko - Nagaokakyo-shi JP
  • Hamada; Kunihiko - Kyoto JP
  • Hamada, Kunihiko - Kyoto-shi JP
  • Hamada, Kunihiko - Moriyama-shi JP
  • Hamada; Kunihiko - Moriyama JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Method for manufacturing ceramic electronic component and ceramic electronic component including cross-linked section
Grant 9,305,707 - Hiramatsu , et al. April 5, 2
2016-04-05
Ceramic electronic component
Grant 9,111,691 - Hamada August 18, 2
2015-08-18
Ceramic electronic component including internal electrode with thick section
Grant 9,105,400 - Hiramatsu , et al. August 11, 2
2015-08-11
Method For Manufacturing Laminated Coil Component
App 20150014899 - HAMADA; Kunihiko ;   et al.
2015-01-15
Ceramic Electronic Component
App 20130329338 - HIRAMATSU; Takashi ;   et al.
2013-12-12
Method For Manufacturing Ceramic Electronic Component And Ceramic Electronic Component
App 20130329334 - HIRAMATSU; Takashi ;   et al.
2013-12-12
Ceramic Electronic Component
App 20130279070 - HAMADA; Kunihiko
2013-10-24
Thick film electrode and multilayer ceramic electronic device
Grant 7,276,841 - Takaoka , et al. October 2, 2
2007-10-02
Thick Film Electrode And Multilayer Ceramic Electronic Device
App 20060232170 - Takaoka; Hidekiyo ;   et al.
2006-10-19
Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component
Grant 7,018,864 - Noda , et al. March 28, 2
2006-03-28
Method for plating electrodes of ceramic chip electronic components
Grant 6,911,138 - Motoki , et al. June 28, 2
2005-06-28
Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component
App 20040214418 - Noda, Satoru ;   et al.
2004-10-28
Pb-free solder composition and soldered article
App 20040096632 - Takaoka, Hidekiyo ;   et al.
2004-05-20
Pb-free solder composition and soldered article
Grant 6,703,113 - Takaoka , et al. March 9, 2
2004-03-09
Ceramic electronic parts and method for manufacturing the same
Grant 6,654,227 - Miki , et al. November 25, 2
2003-11-25
Ceramic electronic component
Grant 6,614,641 - Kayatani , et al. September 2, 2
2003-09-02
Electrically conductive paste and electronic element
Grant 6,585,916 - Sanada , et al. July 1, 2
2003-07-01
Ceramic electronic parts and method for maufacturing the same
App 20030086237 - Miki, Takeshi ;   et al.
2003-05-08
Conductive paste for terminal electrodes of monolithic ceramic electronic component, method for making monolithic ceramic electronic component, and monolithic ceramic electronic component
App 20030064873 - Noda, Satoru ;   et al.
2003-04-03
Method for plating electrodes of ceramic chip electronic components
App 20030052014 - Motoki, Akihiro ;   et al.
2003-03-20
Ceramic electronic component
App 20030037962 - Kayatani, Takayuki ;   et al.
2003-02-27
Laminated ceramic electronic device
Grant 6,370,015 - Noda , et al. April 9, 2
2002-04-09
Pb-free solder composition and soldered article
App 20020012608 - Takaoka, Hidekiyo ;   et al.
2002-01-31
Conductive paste and ceramic electronic component
App 20020006023 - Maegawa, Kiyotaka ;   et al.
2002-01-17
Laminated ceramic electronic device
App 20010030493 - Noda, Satoru ;   et al.
2001-10-18
Conductive paste and ceramic electronic device using the same
App 20010016252 - Nagamoto, Toshiki ;   et al.
2001-08-23
Electrically conductive paste and electronic element
App 20010001481 - Sanada, Yukio ;   et al.
2001-05-24
Base metal composition for external electrode of multilayer electronic component
Grant 5,536,293 - Yamamoto , et al. July 16, 1
1996-07-16

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