Hallock; Robert B.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hallock; Robert B..The latest application filed is for "flip chip mounted monolithic microwave integrated circuit (mmic) structure".

Company Profile

0.11.11

Hallock; Robert B. - Newton NH US
Hallock; Robert B. - Newtown NH US
Hallock; Robert B - Newton NH US
Hallock; Robert B. - Newburyport NH

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for packaging semiconductors at a wafer level Grant 8,653,673 - Hallock , et al. February 18, 2	2014-02-18
Flip chip mounted monolithic microwave integrated circuit (MMIC) structure Grant 8,581,406 - Robbins , et al. November 12, 2	2013-11-12
Flip Chip Mounted Monolithic Microwave Integrated Circuit (mmic) Structure App 20130277843 - Robbins; James A. ; et al.	2013-10-24
Method For Packaging Semiconductors At A Wafer Level App 20130154124 - Hallock; Robert B. ; et al.	2013-06-20
Passivation layer for a circuit device and method of manufacture Grant RE44,303 - Bedinger , et al. June 18, 2	2013-06-18
Polygon Shaped Power Amplifier Chips App 20120313213 - Head; Paul M. ; et al.	2012-12-13
DIE ALIGNMENT WITH CRYSTALLOGRAPHIC AXES IN GaN-ON-SiC AND OTHER NON-CUBIC MATERIAL SUBSTRATES App 20120313111 - Hallock; Robert B. ; et al.	2012-12-13
Passivation layer for a circuit device and method of manufacture Grant 7,902,083 - Bedinger , et al. March 8, 2	2011-03-08
Passivation layer for a circuit device and method of manufacture Grant 7,767,589 - Bedinger , et al. August 3, 2	2010-08-03
Passivation Layer for a Circuit Device and Method of Manufacture App 20100120254 - Bedinger; John M. ; et al.	2010-05-13
Atomic layer deposition in the formation of gate structures for III-V semiconductor Grant 7,692,222 - Tabatabaie , et al. April 6, 2	2010-04-06
Method For Packaging Semiconductors At A Wafer Level App 20080308922 - Zhang; Yiwen ; et al.	2008-12-18
Passivation Layer for a Circuit Device and Method of Manufacture App 20080185174 - Bedinger; John M. ; et al.	2008-08-07
Atomic Layer Deposition In The Formation Of Gate Structures For Iii-v Semiconductor App 20080105901 - Tabatabaie; Kamal ; et al.	2008-05-08
High-power microwave window Grant 6,707,017 - Williamson , et al. March 16, 2	2004-03-16
High-power microwave window App 20030213800 - Williamson, Weldon Stoddard ; et al.	2003-11-20
Process for preparing or purifying Group III-A organometallic compounds Grant 4,847,399 - Hallock , et al. July 11, 1	1989-07-11

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