Halley; David G.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Halley; David G..The latest application filed is for "polishing pad with built-in optical sensor".
- Halley; David G. - San Luis Obispo CA
- Halley; David G. - Los Osos CA
- Halley; David G. - Renton WA
| Patent | Date |
|---|---|
| Polishing pad with built-in optical sensor App 20070032170 - Halley; David G. ; et al. | 2007-02-08 |
| Polishing pad with built-in optical sensor Grant 7,083,497 - Halley , et al. August 1, 2 | 2006-08-01 |
| Polishing Pad With Built-in Optical Sensor App 20060116051 - Halley; David G. ; et al. | 2006-06-01 |
| Polishing pad with built-in optical sensor Grant 6,986,701 - Halley , et al. January 17, 2 | 2006-01-17 |
| In situ feature height measurement Grant 6,976,901 - Halley , et al. December 20, 2 | 2005-12-20 |
| Subaperture chemical mechanical planarization with polishing pad conditioning Grant 6,945,856 - Boyd , et al. September 20, 2 | 2005-09-20 |
| Method of preparing whole semiconductor wafer for analysis Grant 6,921,719 - Paterson , et al. July 26, 2 | 2005-07-26 |
| Pad support method for chemical mechanical planarization Grant 6,887,133 - Halley May 3, 2 | 2005-05-03 |
| Device for supporting thin semiconductor wafers Grant 6,885,206 - Halley April 26, 2 | 2005-04-26 |
| Modular method for chemical mechanical planarization Grant 6,855,030 - Halley February 15, 2 | 2005-02-15 |
| Polishing pad with built-in optical sensor App 20050009449 - Halley, David G. ; et al. | 2005-01-13 |
| Projected gimbal point drive Grant 6,808,443 - Halley October 26, 2 | 2004-10-26 |
| Support for thin wafers App 20040155671 - Halley, David G. | 2004-08-12 |
| Polishing pad with built-in optical sensor Grant 6,739,945 - Halley , et al. May 25, 2 | 2004-05-25 |
| Method of preparing whole semiconductor wafer for analysis App 20040087146 - Paterson, Allan ; et al. | 2004-05-06 |
| Modular method for chemical mechanical planarization App 20040048550 - Halley, David G. | 2004-03-11 |
| Combined chemical mechanical planarization and cleaning Grant 6,692,339 - Halley February 17, 2 | 2004-02-17 |
| Feature height measurement during CMP Grant 6,629,874 - Halley October 7, 2 | 2003-10-07 |
| Subaperture chemical mechanical planarization with polishing pad conditioning App 20030153250 - Boyd, John M. ; et al. | 2003-08-14 |
| Pad support apparatus for chemical mechanical planarization Grant 6,602,121 - Halley August 5, 2 | 2003-08-05 |
| High planarity chemical mechanical planarization Grant 6,520,843 - Halley February 18, 2 | 2003-02-18 |
| Shaping polishing pad for small head chemical mechanical planarization Grant 6,517,419 - Halley February 11, 2 | 2003-02-11 |
| Polishing chemical delivery for small head chemical mechanical planarization Grant 6,514,121 - Halley February 4, 2 | 2003-02-04 |
| Pad quick release device for chemical mechanical planarization Grant 6,464,574 - Halley October 15, 2 | 2002-10-15 |
| Polishing pad with built-in optical sensor App 20020090887 - Halley, David G. ; et al. | 2002-07-11 |
| Method For Chemical Mechanical Polishing App 20020068450 - HALLEY, DAVID G. | 2002-06-06 |
| Wafer support for chemical mechanical planarization Grant 6,379,235 - Halley April 30, 2 | 2002-04-30 |
| Multi-pad apparatus for chemical mechanical planarization Grant 6,346,036 - Halley February 12, 2 | 2002-02-12 |
| Projected gimbal point drive App 20020002031 - Halley, David G. | 2002-01-03 |
| Pad quick release device for chemical mechanical polishing Grant 6,227,956 - Halley May 8, 2 | 2001-05-08 |
| Method of making a limited life pad Grant 4,900,377 - Redford , et al. February 13, 1 | 1990-02-13 |
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