Halleck; William R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Halleck; William R..The latest application filed is for "multiple dies hardware processors and methods".
- Halleck; William R. - Lancaster MA
| Patent | Date |
|---|---|
| Bimodal PHY for low latency in high speed interconnects Grant 11,354,264 - Iyer , et al. June 7, 2 | 2022-06-07 |
| Multiple dies hardware processors and methods Grant 11,294,852 - Nassif , et al. April 5, 2 | 2022-04-05 |
| Multiple Dies Hardware Processors And Methods App 20220050805 - NASSIF; NEVINE ; et al. | 2022-02-17 |
| Bimodal Phy For Low Latency In High Speed Interconnects App 20210182231 - Iyer; Venkatraman ; et al. | 2021-06-17 |
| Bimodal PHY for low latency in high speed interconnects Grant 10,963,415 - Iyer , et al. March 30, 2 | 2021-03-30 |
| High speed interconnect with channel extension Grant 10,931,329 - Shah , et al. February 23, 2 | 2021-02-23 |
| Multiple Dies Hardware Processors And Methods App 20200334196 - NASSIF; NEVINE ; et al. | 2020-10-22 |
| Multiple dies hardware processors and methods Grant 10,795,853 - Nassif , et al. October 6, 2 | 2020-10-06 |
| Bimodal Phy For Low Latency In High Speed Interconnects App 20200293480 - Iyer; Venkatraman ; et al. | 2020-09-17 |
| Bimodal phy for low latency in high speed interconnects Grant 10,599,602 - Iyer , et al. | 2020-03-24 |
| Bimodal Phy For Low Latency In High Speed Interconnects App 20190310959 - Iyer; Venkatraman ; et al. | 2019-10-10 |
| Bimodal PHY for low latency in high speed interconnects Grant 10,372,657 - Iyer , et al. | 2019-08-06 |
| High performance interconnect link state transitions Grant 10,324,882 - Halleck , et al. | 2019-06-18 |
| Link-physical layer interface adapter Grant 10,152,446 - Iyer , et al. Dec | 2018-12-11 |
| High performance interconnect Grant 10,025,746 - Halleck , et al. July 17, 2 | 2018-07-17 |
| High Speed Interconnect With Channel Extension App 20180191523 - Shah; Rahul R. ; et al. | 2018-07-05 |
| Bimodal Phy For Low Latency In High Speed Interconnects App 20180181525 - Iyer; Venkatraman ; et al. | 2018-06-28 |
| Multiple Dies Hardware Processors And Methods App 20180101502 - NASSIF; NEVINE ; et al. | 2018-04-12 |
| Link-physical Layer Interface Adapter App 20180095923 - Iyer; Venkatraman ; et al. | 2018-04-05 |
| High performance interconnect link state transitions Grant 9,910,809 - Halleck , et al. March 6, 2 | 2018-03-06 |
| High Performance Interconnect Link State Transitions App 20170109300 - Halleck; William R. ; et al. | 2017-04-20 |
| High Performance Interconnect Link State Transitions App 20160179730 - Halleck; William R. ; et al. | 2016-06-23 |
| High Performance Interconnect App 20160179740 - Halleck; William R. ; et al. | 2016-06-23 |
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