Hakata; Tomoyuki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hakata; Tomoyuki.The latest application filed is for "production method of bonded structure and bonded structure".
- Hakata; Tomoyuki - Uji JP
- HAKATA; Tomoyuki - Uji-shi KYOTO
- Hakata; Tomoyuki - Kyoto JP
| Patent | Date |
|---|---|
| Crimp structure, crimping method, and electronic device Grant 10,632,517 - Teramoto , et al. | 2020-04-28 |
| Manufacturing method of bonding structure and bonding structure Grant 10,471,660 - Nishikawa , et al. Nov | 2019-11-12 |
| Bonded structure and method for producing bonded structure Grant 10,449,698 - Nishikawa , et al. Oc | 2019-10-22 |
| Production Method Of Bonded Structure And Bonded Structure App 20180207847 - NISHIKAWA; Kazuyoshi ; et al. | 2018-07-26 |
| Transformer App 20170352470 - Yamagami; Masahiro ; et al. | 2017-12-07 |
| Crimp structure, crimping method, and electronic device Grant 9,793,637 - Teramoto , et al. October 17, 2 | 2017-10-17 |
| Bonded Structure And Method For Producing Bonded Structure App 20170259468 - NISHIKAWA; Kazuyoshi ; et al. | 2017-09-14 |
| Manufacturing Method Of Bonding Structure And Bonding Structure App 20170210058 - NISHIKAWA; Kazuyoshi ; et al. | 2017-07-27 |
| Crimp Structure, Crimping Method, And Electronic Device App 20170120321 - TERAMOTO; Eiji ; et al. | 2017-05-04 |
| Crimp Structure, Crimping Method, And Electronic Device App 20170098905 - TERAMOTO; Eiji ; et al. | 2017-04-06 |
| Joined Structure And Method For Manufacturing Joined Structure App 20160052202 - Nishikawa; Kazuyoshi ; et al. | 2016-02-25 |
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