Hajime; Hirofumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hajime; Hirofumi.The latest application filed is for "thermoelectric module and metallized substrate".
- Hajime; Hirofumi - Kanagawa JP
- Hajime; Hirofumi - Miyazaki JP
| Patent | Date |
|---|---|
| Thermoelectric Module And Metallized Substrate App 20100031989 - Kinoshi; Akio ; et al. | 2010-02-11 |
| Method for fabricating semiconductor wafers Grant 5,899,743 - Kai , et al. May 4, 1 | 1999-05-04 |
| Method of manufacturing semiconductor wafers Grant 5,821,166 - Hajime , et al. October 13, 1 | 1998-10-13 |
| Process for making semiconductor wafer Grant 5,756,399 - Hajime , et al. May 26, 1 | 1998-05-26 |
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