Haji; Hiroshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Haji; Hiroshi.The latest application filed is for "light-emitting components containing body, manufacturing method of light-emitting components containing body, components mounting apparatus, components mounting method, and components mounting system".

Company Profile

0.47.39

Haji; Hiroshi - Osaka JP
Haji; Hiroshi - Fukuoka N/A JP
Haji; Hiroshi - Yamanashi JP
Haji; Hiroshi - Chikushino JP
Haji; Hiroshi - Fukuoka-ken JP
Haji; Hiroshi - Chikushino-shi JP
Haji; Hiroshi - Fukuaka JP
Haji; Hiroshi - Kasuga JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Light-emitting components containing body, manufacturing method of light-emitting components containing body, components mounting apparatus, components mounting method, and components mounting system Grant 10,069,042 - Haji , et al. September 4, 2	2018-09-04
Cultivation system Grant 9,775,301 - Nagadome , et al. October 3, 2	2017-10-03
Plant cultivation system Grant 9,433,158 - Nagadome , et al. September 6, 2	2016-09-06
Light-emitting Components Containing Body, Manufacturing Method Of Light-emitting Components Containing Body, Components Mounting Apparatus, Components Mounting Method, And Components Mounting System App 20160138787 - HAJI; Hiroshi ; et al.	2016-05-19
Plant Cultivation System App 20150014440 - Nagadome; Ryuji ; et al.	2015-01-15
Cultivation System App 20150000191 - Nagadome; Ryuji ; et al.	2015-01-01
Component bonding method, component laminating method and bonded component structure Grant 8,614,118 - Haji , et al. December 24, 2	2013-12-24
Plasma processing apparatus Grant 8,558,460 - Nonomura , et al. October 15, 2	2013-10-15
Plasma processing apparatus Grant 8,450,933 - Nonomura , et al. May 28, 2	2013-05-28
Substrate processing method, semiconductor chip manufacturing method, and resin-adhesive-layer-backed semiconductor chip manufacturing method Grant 8,288,284 - Arita , et al. October 16, 2	2012-10-16
Chip pickup apparatus, chip pickup method, chip releasing device and chip releasing method Grant 8,192,578 - Haji , et al. June 5, 2	2012-06-05
Method for processing a substrate, method for manufacturing a semiconductor chip, and method for manufacturing a semiconductor chip having a resin adhesive layer Grant 8,158,494 - Haji , et al. April 17, 2	2012-04-17
Substrate Processing Method, Semiconductor Chip Manufacturing Method, And Resin-adhesive-layer-backed Semiconductor Chip Manufacturing Method App 20120021608 - Arita; Kiyoshi ; et al.	2012-01-26
Plasma Processing Apparatus App 20110277933 - Nonomura; Masaru ; et al.	2011-11-17
Plasma Processing Apparatus App 20110273094 - Nonomura; Masaru ; et al.	2011-11-10
Method for manufacturing semiconductor chip and method for processing semiconductor wafer Grant 7,964,449 - Haji , et al. June 21, 2	2011-06-21
Method for dividing semiconductor wafer and manufacturing method for semiconductor devices Grant 7,927,973 - Haji , et al. April 19, 2	2011-04-19
Method For Processing A Substrate, Method For Manufacturing A Semiconductor Chip, And Method For Manufacturing A Semiconductor Chip Having A Resin Adhesive Layer App 20110014777 - Haji; Hiroshi ; et al.	2011-01-20
Component mounting apparatus Grant 7,797,820 - Shida , et al. September 21, 2	2010-09-21
Method for fabricating semiconductor chip Grant 7,767,551 - Arita , et al. August 3, 2	2010-08-03
Method For Manufacturing Semiconductor Chip And Method For Processing Semiconductor Wafer App 20100055875 - Haji; Hiroshi ; et al.	2010-03-04
Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks Grant 7,629,228 - Haji , et al. December 8, 2	2009-12-08
Chip Pickup Apparatus, Chip Pickup Method, Chip Releasing Device And Chip Releasing Method App 20090279995 - Haji; Hiroshi ; et al.	2009-11-12
Electronic Component Pickup Method, Electronic Component Mounting Method And Electronic Component Mounting Apparatus App 20090202333 - Ozono; Mitsuru ; et al.	2009-08-13
Method for dividing semiconductor wafer and manufacturing method for semiconductor devices App 20090197393 - Haji; Hiroshi ; et al.	2009-08-06
Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions Grant 7,488,668 - Arita , et al. February 10, 2	2009-02-10
Component Bonding Method, Component Laminating Method And Bonded Component Structure App 20090035892 - Haji; Hiroshi ; et al.	2009-02-05
Electronic Component Pickup Method, Electronic Component Mounting Method and Electronic Component Mounting Apparatus App 20090000109 - Ozono; Mitsuru ; et al.	2009-01-01
Method for Fabricating Semiconductor Chip App 20090004780 - Arita; Kiyoshi ; et al.	2009-01-01
Electronic component mounting apparatus and method of mounting electronic components Grant 7,409,761 - Haji , et al. August 12, 2	2008-08-12
Component mounting apparatus and component mounting method App 20080163481 - Shida; Satoshi ; et al.	2008-07-10
Electronic Component Mounting Apparatus And method Of Mounting Electronic Components App 20080104831 - Haji; Hiroshi ; et al.	2008-05-08
Component mounting method Grant 7,353,596 - Shida , et al. April 8, 2	2008-04-08
Surface Treating Apparatus Using Atomic Hydrogen App 20080029197 - Haji; Hiroshi ; et al.	2008-02-07
Electronic component mounting method Grant 7,243,420 - Haji , et al. July 17, 2	2007-07-17
Electronic component mounting apparatus and electronic component mounting method Grant 7,222,774 - Haji May 29, 2	2007-05-29
Method for mounting electronic parts onto a board Grant 7,137,195 - Haji , et al. November 21, 2	2006-11-21
Electrode member used in a plasma treating apparatus Grant 7,138,034 - Arita , et al. November 21, 2	2006-11-21
Electronic component mounting apparatus and electronic component mounting method App 20060201999 - Haji; Hiroshi	2006-09-14
Parts packaging device and parts packaging method App 20060185157 - Shida; Satoshi ; et al.	2006-08-24
Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor device Grant 7,074,720 - Arita , et al. July 11, 2	2006-07-11
Method for mounting an electronic part by solder position detection Grant 7,059,043 - Hidese , et al. June 13, 2	2006-06-13
Electronic component mounting apparatus and electronic component mounting method Grant 7,033,842 - Haji , et al. April 25, 2	2006-04-25
Electronic component mounting apparatus and electronic component mounting method Grant 7,025,244 - Haji April 11, 2	2006-04-11
Manufacturing method for semiconductor devices, and formation apparatus for semiconductor wafer dicing masks App 20060024924 - Haji; Hiroshi ; et al.	2006-02-02
Manufacturing method for semiconductor devices, arrangement determination method and apparatus for semiconductor device formation regions, and program for determining arrangement of semiconductor device formation regions App 20060019416 - Arita; Kiyoshi ; et al.	2006-01-26
Apparatus and method for mounting electronic parts App 20050108873 - Hidese, Wataru ; et al.	2005-05-26
Method for mounting semiconductor chip and semiconductor chip-mounted board App 20050110161 - Naito, Hiroyuki ; et al.	2005-05-26
Electronic component mounting apparatus and electronic component mounting method App 20050072831 - Haji, Hiroshi	2005-04-07
Electronic component mounting apparatus Grant 6,874,225 - Haji , et al. April 5, 2	2005-04-05
Method of manufacturing semiconductor device Grant 6,852,572 - Haji , et al. February 8, 2	2005-02-08
Method for mounting electronic parts on a board Grant 6,839,960 - Hidese , et al. January 11, 2	2005-01-11
Electronic component mounting apparatus and electronic component mounting method App 20040205961 - Haji, Hiroshi ; et al.	2004-10-21
Apparatus and method for mounting electronic parts Grant 6,792,676 - Haji , et al. September 21, 2	2004-09-21
Method for surface treatment of silicon based substrate Grant 6,784,112 - Arita , et al. August 31, 2	2004-08-31
Electric component placement machine Grant D494,988 - Tanaka , et al. August 24, 2	2004-08-24
Apparatus and method for mounting electronic parts App 20040148769 - Haji, Hiroshi ; et al.	2004-08-05
Electric component placement machine Grant D493,808 - Tanaka , et al. August 3, 2	2004-08-03
Semiconductor device with reinforcing resin layer Grant 6,683,379 - Haji , et al. January 27, 2	2004-01-27
Electronic component mounting apparatus and electronic component mounting method App 20030177633 - Haji, Hiroshi ; et al.	2003-09-25
Electronic component mounting apparatus and electronic component mounting method App 20030110623 - Haji, Hiroshi ; et al.	2003-06-19
Semiconductor wafer processing apparatus App 20030082914 - Koma, Yutaka ; et al.	2003-05-01
Apparatus and method for mounting electronic parts App 20030029033 - Hidese, Wataru ; et al.	2003-02-13
Apparatus and method for mounting electronic parts App 20030029032 - Haji, Hiroshi ; et al.	2003-02-13
Semiconductor wafer turning process Grant 6,511,895 - Koma , et al. January 28, 2	2003-01-28
Electrode member for plasma treating apparatus, plasma treating apparatus and plasma treating method App 20020195202 - Arita, Kiyoshi ; et al.	2002-12-26
Plasma treating apparatus, plasma treating method and method of manufacturing semiconductor device App 20020197877 - Arita, Kiyoshi ; et al.	2002-12-26
Method for surface treatment of silicon based substrate App 20020148810 - Arita, Kiyoshi ; et al.	2002-10-17
Semiconductor device and method of manufacturing the same App 20020061642 - Haji, Hiroshi ; et al.	2002-05-23
Semiconductor device and method of manufacturing the same Grant 6,350,664 - Haji , et al. February 26, 2	2002-02-26
Plasma processing apparatus and method Grant 6,313,583 - Arita , et al. November 6, 2	2001-11-06
Semiconductor wafer processing apparatus App 20010021571 - Koma, Yutaka ; et al.	2001-09-13
Plasma treatment apparatus and method App 20010018272 - Haji, Hiroshi ; et al.	2001-08-30
Method of manufacturing semiconductor device App 20010018233 - Haji, Hiroshi ; et al.	2001-08-30
Method For Forming A Gold Plating Electrode A Substrate Based On The Electrode Forming Method ,and A Wire Bonding Method Utilizing This Electrode Forming Method. App 20010008685 - HAJI, HIROSHI	2001-07-19
Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus Grant 6,093,904 - Haji July 25, 2	2000-07-25
Method of producing a semiconductor device Grant 5,846,875 - Haji December 8, 1	1998-12-08
Apparatus and method for surface treatment, and apparatus and method for wire bonding using the surface treatment apparatus Grant 5,823,416 - Haji October 20, 1	1998-10-20
Method for forming a gold plating electrode, a substrate based on the electrode forming method, and a wire bonding method utilizing this electrode forming method Grant 5,767,008 - Haji June 16, 1	1998-06-16
Electric discharge apparatus for cleaning electrode on workpiece and method thereof Grant 5,676,856 - Haji , et al. October 14, 1	1997-10-14
Wire bonding apparatus and wire bonding method Grant 5,653,380 - Haji August 5, 1	1997-08-05
Wire bonding method Grant 5,647,942 - Haji July 15, 1	1997-07-15
Method of forming inner lead bonding on a microchip Grant 5,288,008 - Haji , et al. February 22, 1	1994-02-22

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