Hainz, Oswald
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hainz, Oswald.The latest application filed is for "method for manufacturing a component which is encapsulated in plastic, and a component which is encapsulated in plastic".
- Hainz, Oswald - Burglengenfeld DE
| Patent | Date |
|---|---|
| Method for manufacturing a component which is encapsulated in plastic, and a component which is encapsulated in plastic App 20020076852 - Paulus, Stefan ; et al. | 2002-06-20 |
| Connection of a semiconductor component to a metal carrier Grant 5,138,428 - Hainz , et al. August 11, 1 | 1992-08-11 |
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