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Patent applications and USPTO patent grants for Haino; Takao.The latest application filed is for "method of reworking magnetic head assembly in which electrode pad of magnetic head slider and electrode pad of suspension are soldered to each other".
Patent | Date |
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Method of bonding metal ball for magnetic head assembly Grant 7,765,678 - Yamaguchi , et al. August 3, 2 | 2010-08-03 |
Magnetic head assembly bonding electrode pad of slider and electrode pad of flexible wiring substrate together by solder Grant 7,649,715 - Yamaguchi , et al. January 19, 2 | 2010-01-19 |
Method of reworking magnetic head assembly in which electrode pad of magnetic head slider and electrode pad of suspension are soldered to each other App 20070274006 - Yamaguchi; Ooki ;   et al. | 2007-11-29 |
Magnetic Head Assembly Bonding Electrode Pad Of Slider And Electrode Pad Of Flexible Wiring Substrate Together By Solder App 20070097550 - Yamaguchi; Ooki ;   et al. | 2007-05-03 |
MAGNETIC HEAD ASSEMBLY HAVING AuSn DISPERSION LAYER AND METHOD OF SOLDER BONDING App 20070097549 - Yamaguchi; Ooki ;   et al. | 2007-05-03 |
Method of bonding metal ball for magnetic head assembly App 20070012749 - Yamaguchi; Ooki ;   et al. | 2007-01-18 |
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