| Patent | Date |
|---|
Smart card module, smart card, and method for producing a smart card module
Grant 10,198,684 - Pueschner , et al. Fe | 2019-02-05 |
Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages
Grant 10,128,180 - Bauer , et al. November 13, 2 | 2018-11-13 |
Chip Packages, Chip Arrangements, A Circuit Board, And Methods For Manufacturing Chip Packages
App 20180096924 - Bauer; Michael ; et al. | 2018-04-05 |
Chip packages, chip arrangements, a circuit board, and methods for manufacturing chip packages
Grant 9,859,198 - Bauer , et al. January 2, 2 | 2018-01-02 |
Chip arrangement and method for producing a chip arrangement
Grant 9,633,927 - Mahler , et al. April 25, 2 | 2017-04-25 |
Smart Card Module, Smart Card, And Method For Producing A Smart Card Module
App 20150339565 - PUESCHNER; Frank ; et al. | 2015-11-26 |
Chip Packages, Chip Arrangements, A Circuit Board, And Methods For Manufacturing Chip Packages
App 20150097282 - Bauer; Michael ; et al. | 2015-04-09 |
Chip Packages, Chip Arrangements, A Circuit Board, And Methods For Manufacturing Chip Packages
App 20140001622 - Bauer; Michael ; et al. | 2014-01-02 |
Chip Arrangement And Method For Producing A Chip Arrangement
App 20130328206 - Mahler; Joachim ; et al. | 2013-12-12 |
Chip arrangement and method for producing a chip arrangement
Grant 8,519,547 - Mahler , et al. August 27, 2 | 2013-08-27 |
Thermoplastic-thermosetting composite and method for bonding a thermoplastic material to a thermosetting material
Grant 8,507,080 - Mahler , et al. August 13, 2 | 2013-08-13 |
Semiconductor component and production method
Grant 8,440,733 - Mahler , et al. May 14, 2 | 2013-05-14 |
Chip Arrangement And Method For Producing A Chip Arrangement
App 20130062781 - Mahler; Joachim ; et al. | 2013-03-14 |
Semiconductor component having a stack of semiconductor chips and method for producing the same
Grant 8,354,299 - Bauer , et al. January 15, 2 | 2013-01-15 |
Semiconductor Component And Production Method
App 20120223424 - Mahler; Joachim ; et al. | 2012-09-06 |
Semiconductor component and production method
Grant 8,178,390 - Mahler , et al. May 15, 2 | 2012-05-15 |
Chip arrangement and method for producing a chip arrangement
Grant 8,129,831 - Mahler , et al. March 6, 2 | 2012-03-06 |
Semiconductor module with at least two substrates
Grant 8,017,438 - Bauer , et al. September 13, 2 | 2011-09-13 |
Power semiconductor device in lead frame employing connecting element with conductive film
Grant 8,013,441 - Bauer , et al. September 6, 2 | 2011-09-06 |
Component arrangement comprising a carrier
Grant 7,911,039 - Bauer , et al. March 22, 2 | 2011-03-22 |
Semiconductor chip comprising a metal coating structure and associated production method
Grant 7,880,300 - Bauer , et al. February 1, 2 | 2011-02-01 |
Layer between interfaces of different components in semiconductor devices
Grant 7,834,467 - Bauer , et al. November 16, 2 | 2010-11-16 |
Method of producing an electronic component with flexible bonding
Grant 7,820,482 - Hedler , et al. October 26, 2 | 2010-10-26 |
Semiconductor module having discrete components and method for producing the same
Grant 7,795,727 - Bauer , et al. September 14, 2 | 2010-09-14 |
Semiconductor Component Having A Stack Of Semiconductor Chips And Method For Producing The Same
App 20100207277 - Bauer; Michael ; et al. | 2010-08-19 |
Semiconductor component including semiconductor chip and method for producing the same
Grant 7,768,107 - Bauer , et al. August 3, 2 | 2010-08-03 |
Semiconductor device having a sensor chip, and method for producing the same
Grant 7,749,797 - Bauer , et al. July 6, 2 | 2010-07-06 |
Plastic housing composition for embedding semiconductor devices in a plastic housing and use of the plastic housing composition
Grant 7,728,053 - Bauer , et al. June 1, 2 | 2010-06-01 |
Electronic module with a semiconductor chip and a component housing and methods for producing the same
Grant 7,714,422 - Bauer , et al. May 11, 2 | 2010-05-11 |
Semiconductor device with semiconductor chip and method for producing it
Grant 7,705,436 - Mahler , et al. April 27, 2 | 2010-04-27 |
Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite
Grant 7,645,642 - Bauer , et al. January 12, 2 | 2010-01-12 |
Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof
Grant 7,629,660 - Bauer , et al. December 8, 2 | 2009-12-08 |
Thermoplastic-thermosetting Composite And Method For Bonding A Thermoplastic Material To A Thermosetting Material
App 20090280314 - Mahler; Joachim ; et al. | 2009-11-12 |
Semiconductor device including a stress buffer
Grant 7,612,457 - Mahler , et al. November 3, 2 | 2009-11-03 |
Lead structure for a semiconductor component and method for producing the same
Grant 7,589,403 - Bauer , et al. September 15, 2 | 2009-09-15 |
Semiconductor substrate with strip conductors formed of carbon nanotubes and production thereof
Grant 7,504,711 - Beer , et al. March 17, 2 | 2009-03-17 |
Semiconductor device with semiconductor chip and method for producing it
App 20090039484 - Mahler; Joachim ; et al. | 2009-02-12 |
Semiconductor Device Having A Sensor Chip, And Method For Producing The Same
App 20090026558 - Bauer; Michael ; et al. | 2009-01-29 |
Semiconductor Device Including A Stress Buffer
App 20080315438 - Mahler; Joachim ; et al. | 2008-12-25 |
Sensor component with a cavity housing and a sensor chip and method for producing the same
Grant 7,464,603 - Bauer , et al. December 16, 2 | 2008-12-16 |
Method For Stacking Semiconductor Chips And Semiconductor Chip Stack Produced By The Method
App 20080303172 - Bauer; Michael ; et al. | 2008-12-11 |
Semiconductor component comprising flip chip contacts with polymer cores and method of producing the same
Grant 7,462,940 - Bauer , et al. December 9, 2 | 2008-12-09 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
Grant 7,443,019 - Bauer , et al. October 28, 2 | 2008-10-28 |
Lead Structure for a Semiconductor Component and Method for Producing the Same
App 20080224301 - Bauer; Michael ; et al. | 2008-09-18 |
Sensor Component With a Cavity Housing and a Sensor Chip and Method for Producing the Same
App 20080173097 - Bauer; Michael ; et al. | 2008-07-24 |
Chip Arrangement And Method For Producing A Chip Arrangement
App 20080173998 - Mahler; Joachim ; et al. | 2008-07-24 |
Semiconductor Module With At Least Two Substrates
App 20080122075 - Bauer; Michael ; et al. | 2008-05-29 |
Component arrangement comprising a carrier
App 20080111216 - BAUER; Michael ; et al. | 2008-05-15 |
Electronic component with flexible contacting pads and method for producing the electronic component
Grant 7,312,533 - Haimerl , et al. December 25, 2 | 2007-12-25 |
Circuit Arrangement, System Carrier and Methods for Producing Same
App 20070278637 - Bauer; Michael ; et al. | 2007-12-06 |
Electronic Module with a Semiconductor Chip and a Component Housing and Methods for Producing the Same
App 20070268674 - Bauer; Michael ; et al. | 2007-11-22 |
Semiconductor Module Havingdiscrete Components And Method For Producing The Same
App 20070235865 - Bauer; Michael ; et al. | 2007-10-11 |
Semiconductor Chip Comprising A Metal Coating Structure And Associated Production Method
App 20070228567 - Bauer; Michael ; et al. | 2007-10-04 |
Substrate with Strip Conductors and Production of Strip Conductors on Substrates for Semiconductor Components
App 20070210883 - Beer; Gottfried ; et al. | 2007-09-13 |
Flexible rewiring plate for semiconductor components, and process for producing it
Grant 7,268,423 - Beer , et al. September 11, 2 | 2007-09-11 |
Layer Between Interfaces of Different Components in Semiconductor Devices
App 20070205518 - Bauer; Michael ; et al. | 2007-09-06 |
Semiconductor Component Comprising Flip Chip Contacts And Method For Producing The Same
App 20070182021 - Bauer; Michael ; et al. | 2007-08-09 |
Semiconductor component including semiconductor chip and method for producing the same
App 20070145552 - Bauer; Michael ; et al. | 2007-06-28 |
Semiconductor component and sensor component for data transmission devices
Grant 7,230,309 - Bauer , et al. June 12, 2 | 2007-06-12 |
Power semiconductor device in lead frame technology with a vertical current path
App 20070085201 - Bauer; Michael ; et al. | 2007-04-19 |
Plastic housing composition for embedding semicondutor devices in a plastic housing and use of the plastic housing composition
App 20070054530 - Bauer; Michael ; et al. | 2007-03-08 |
Semiconductor device with conductor tracks between semiconductor chip and circuit carrier and method for producing the same
App 20070034997 - Bauer; Michael ; et al. | 2007-02-15 |
Semiconductor sensor component including a sensor chip and methods for the manufacturing thereof
App 20060273420 - Bauer; Michael ; et al. | 2006-12-07 |
Method of joining a thermoplastic material to a thermoset material, and thermoplastic-thermoset composite
App 20060175583 - Bauer; Michael ; et al. | 2006-08-10 |
Electronic component with flexible bonding pads and method of producing such a component
Grant 6,956,287 - Hedler , et al. October 18, 2 | 2005-10-18 |
Substrate-based chip package
Grant 6,949,820 - Reiss , et al. September 27, 2 | 2005-09-27 |
Method of producing an electronic component with flexible bonding pads
App 20050208703 - Hedler, Harry ; et al. | 2005-09-22 |
Electronic component with an insulating layer formed from fluorinated norbornene polymer and method for manufacturing the insulating layers
Grant 6,914,328 - Haimerl July 5, 2 | 2005-07-05 |
Flexible rewiring plate for semiconductor components, and process for producing it
App 20050142933 - Beer, Gottfried ; et al. | 2005-06-30 |
Electronic component with flexible contacting pads and method for producing the electronic component
App 20050127527 - Haimerl, Alfred ; et al. | 2005-06-16 |
Electronic component with flexible contacting pads and method for producing the electronic component
Grant 6,897,568 - Haimerl , et al. May 24, 2 | 2005-05-24 |
Semiconductor component and sensor component for data transmission devices
App 20050104149 - Bauer, Michael ; et al. | 2005-05-19 |
Substrate-based chip package
App 20050006741 - Reiss, Martin ; et al. | 2005-01-13 |
Electronic component with flexible contacting pads and method for producing the electronic component
App 20030067755 - Haimerl, Alfred ; et al. | 2003-04-10 |
Electronic component with an insulating layer formed from fluorinated norbornene polymer and method for manufacturing the insulating layers
App 20020103318 - Haimerl, Alfred | 2002-08-01 |
Electronic component with flexible bonding pads and method of producing such a component
App 20020089058 - Hedler, Harry ; et al. | 2002-07-11 |
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