Hagleitner; Helmut

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hagleitner; Helmut.The latest application filed is for "ohmic contact structure for group iii nitride semiconductor device having improved surface morphology and well-defined edge features".

Company Profile

0.42.37

Hagleitner; Helmut - Zebulon NC

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of forming vias in silicon carbide and resulting devices and circuits Grant 10,367,074 - Ring , et al. July 30, 2	2019-07-30
Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features Grant 10,090,394 - Hagleitner , et al. October 2, 2	2018-10-02
Polymer via plugs with high thermal integrity Grant 10,020,244 - Mieczkowski , et al. July 10, 2	2018-07-10
Encapsulation of advanced devices using novel PECVD and ALD schemes Grant 9,812,338 - Ring , et al. November 7, 2	2017-11-07
Schottky contact Grant 9,640,627 - Hagleitner , et al. May 2, 2	2017-05-02
Semiconductor device with improved field plate Grant 9,608,078 - Hagleitner , et al. March 28, 2	2017-03-28
Contact pad Grant 9,607,955 - Mieczkowski , et al. March 28, 2	2017-03-28
Ohmic Contact Structure For Group Iii Nitride Semiconductor Device Having Improved Surface Morphology And Well-defined Edge Features App 20170077254 - Hagleitner; Helmut ; et al.	2017-03-16
Ohmic contact structure for group III nitride semiconductor device having improved surface morphology and well-defined edge features Grant 9,548,206 - Hagleitner , et al. January 17, 2	2017-01-17
Method Of Forming Vias In Silicon Carbide And Resulting Devices And Circuits App 20170012106 - Ring; Zoltan ; et al.	2017-01-12
Wafer-level die attach metallization Grant 9,536,783 - Radulescu , et al. January 3, 2	2017-01-03
Method of forming vias in silicon carbide and resulting devices and circuits Grant 9,490,169 - Ring , et al. November 8, 2	2016-11-08
Gate contact for a semiconductor device and methods of fabrication thereof Grant 9,343,543 - Radulescu , et al. May 17, 2	2016-05-17
Semiconductor Device With Improved Field Plate App 20160111503 - Hagleitner; Helmut ; et al.	2016-04-21
Semiconductor Device With Improved Field Plate App 20160111502 - Hagleitner; Helmut	2016-04-21
Using stress reduction barrier sub-layers in a semiconductor die Grant 9,269,662 - Ring , et al. February 23, 2	2016-02-23
Gate Contact For A Semiconductor Device And Methods Of Fabrication Thereof App 20150364569 - Radulescu; Fabian ; et al.	2015-12-17
Ohmic contact to semiconductor device Grant 9,214,352 - Hagleitner , et al. December 15, 2	2015-12-15
Ni-rich Schottky contact Grant 9,202,703 - Hagleitner , et al. December 1, 2	2015-12-01
Multilayer diffusion barriers for wide bandgap Schottky barrier devices Grant 9,142,631 - Mieczkowski , et al. September 22, 2	2015-09-22
Wafer-level Die Attach Metallization App 20150140806 - Radulescu; Fabian ; et al.	2015-05-21
Hydrogen mitigation schemes in the passivation of advanced devices Grant 8,994,073 - Hagleitner , et al. March 31, 2	2015-03-31
Dielectric solder barrier for semiconductor devices Grant 8,994,182 - Hagleitner , et al. March 31, 2	2015-03-31
Gate contact for a semiconductor device and methods of fabrication thereof Grant 8,969,927 - Radulescu , et al. March 3, 2	2015-03-03
Wafer-level die attach metallization Grant 8,970,010 - Radulescu , et al. March 3, 2	2015-03-03
Semiconductor devices having improved adhesion and methods of fabricating the same Grant 8,907,350 - Mieczkowski , et al. December 9, 2	2014-12-09
Semiconductor devices having gates including oxidized nickel Grant 8,896,122 - Mieczkowski , et al. November 25, 2	2014-11-25
Encapsulation Of Advanced Devices Using Novel Pecvd And Ald Schemes App 20140264960 - Ring; Zoltan ; et al.	2014-09-18
Gate Contact For A Semiconductor Device And Methods Of Fabrication Thereof App 20140264713 - Radulescu; Fabian ; et al.	2014-09-18
Wafer-level Die Attach Metallization App 20140264868 - Radulescu; Fabian ; et al.	2014-09-18
Dielectric Solder Barrier For Semiconductor Devices App 20140175664 - Hagleitner; Helmut ; et al.	2014-06-26
Ni-rich Schottky Contact App 20140124792 - Hagleitner; Helmut ; et al.	2014-05-08
Using Stress Reduction Barrier Sub-layers In A Semiconductor Die App 20140103363 - Ring; Zoltan ; et al.	2014-04-17
Hydrogen Mitigation Schemes In The Passivation Of Advanced Devices App 20140097469 - Hagleitner; Helmut ; et al.	2014-04-10
Methods of forming contact structures including alternating metal and silicon layers and related devices Grant 8,563,372 - Hagleitner , et al. October 22, 2	2013-10-22
Via Plugs App 20130256841 - Mieczkowski; Van ; et al.	2013-10-03
Schottky Contact App 20130234278 - Hagleitner; Helmut ; et al.	2013-09-12
Ohmic Contact To Semiconductor Device App 20120175682 - Hagleitner; Helmut ; et al.	2012-07-12
Method of forming vias in silicon carbide and resulting devices and circuits Grant 8,202,796 - Ring , et al. June 19, 2	2012-06-19
Ohmic Contact Structure For Group Iii Nitride Semiconductor Device Having Improved Surface Morphology And Well-defined Edge Features App 20120139084 - Hagleitner; Helmut ; et al.	2012-06-07
Contact Pad App 20120115319 - Mieczkowski; Van ; et al.	2012-05-10
Diode having reduced on-resistance and associated method of manufacture Grant 8,138,583 - Sriram , et al. March 20, 2	2012-03-20
Semiconductor Devices Having Gates Including Oxidized Nickel and Related Methods of Fabricating the Same App 20110278590 - Mieczkowski; Van ; et al.	2011-11-17
Semiconductor Devices Having Improved Adhesion and Methods of Fabricating the Same App 20110266557 - Mieczkowski; Van ; et al.	2011-11-03
Multilayer Diffusion Barriers For Wide Bandgap Schottky Barrier Devices App 20110227089 - Mieczkowski; Van ; et al.	2011-09-22
Methods of Forming Contact Structures Including Alternating Metal and Silicon Layers and Related Devices App 20110193135 - Hagleitner; Helmut ; et al.	2011-08-11
Method Of Forming Vias In Silicon Carbide And Resulting Devices And Circuits App 20110165771 - Ring; Zoltan ; et al.	2011-07-07
Method Of Forming Vias In Silicon Carbide And Resulting Devices And Circuits App 20110108855 - Ring; Zoltan ; et al.	2011-05-12
Method of forming vias in silicon carbide and resulting devices and circuits Grant 7,892,974 - Ring , et al. February 22, 2	2011-02-22
Silicon-rich nickel-silicide ohmic contacts for SiC semiconductor devices Grant 7,875,545 - Ward, III , et al. January 25, 2	2011-01-25
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides Grant 7,858,460 - Ring , et al. December 28, 2	2010-12-28
Passivation of Wide Band-Gap Based Semiconductor Devices with Hydrogen-Free Sputtered Nitrides App 20090215280 - Ring; Zoltan ; et al.	2009-08-27
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides Grant 7,525,122 - Ring , et al. April 28, 2	2009-04-28
Method of Forming Vias in Silicon Carbide and Resulting Devices and Circuits App 20090104738 - Ring; Zoltan ; et al.	2009-04-23
Diode Having Reduced On-resistance and Associated Method of Manufacture App 20080197360 - Sriram; Saptharishi ; et al.	2008-08-21
Silicon-Rich Nickel-Silicide Ohmic Contacts for SIC Semiconductor Devices App 20080116464 - WARD; ALLAN III ; et al.	2008-05-22
Diffusion Barrier For Light Emitting Diodes App 20080042145 - Hagleitner; Helmut ; et al.	2008-02-21
Passivation of wide band-gap based semiconductor devices with hydrogen-free sputtered nitrides App 20070001174 - Ring; Zoltan ; et al.	2007-01-04
Method of forming vias in silicon carbide and resulting devices and circuits Grant 7,125,786 - Ring , et al. October 24, 2	2006-10-24
Method of forming vias in silicon carbide and resulting devices and circuits App 20060065910 - Ring; Zoltan ; et al.	2006-03-30
Methods of fabricating high voltage, high temperature capacitor and interconnection structures Grant 6,998,322 - Das , et al. February 14, 2	2006-02-14
Silicon-rich nickel-silicide ohmic contacts for SiC semiconductor devices App 20060006393 - Ward; Allan III ; et al.	2006-01-12
High voltage, high temperature capacitor and interconnection structures Grant 6,972,436 - Das , et al. December 6, 2	2005-12-06
Reflective ohmic contacts for silicon carbide including a layer consisting essentially of nickel, methods of fabricating same, and light emitting devices including the same Grant 6,794,684 - Slater, Jr. , et al. September 21, 2	2004-09-21
Reflective ohmic contacts for silicon carbide including a layer consisting essentially of nickel, methods of fabricating same, and light emitting devices including the same App 20030168663 - Slater, David B. JR. ; et al.	2003-09-11
Methods of fabricating high voltage, high temperature capacitor and interconnection structures App 20030160274 - Das, Mrinal Kanti ; et al.	2003-08-28
High voltage, high temperature capacitor structures and methods of fabricating same App 20020030191 - Das, Mrinal Kanti ; et al.	2002-03-14

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.