Hagiwara; Yoshihito
Patent Applications and Registrations
Patent applications and USPTO patent grants for Hagiwara; Yoshihito.The latest application filed is for "method of mounting die".
- Hagiwara; Yoshihito - Tokyo JP
| Patent | Date |
|---|---|
| Bonding apparatus and bonding method Grant 11,189,594 - Watanabe , et al. November 30, 2 | 2021-11-30 |
| Method of mounting die Grant 11,069,651 - Watanabe , et al. July 20, 2 | 2021-07-20 |
| Semiconductor chip mounting apparatus and semiconductor chip mounting method Grant 10,978,420 - Hagiwara , et al. April 13, 2 | 2021-04-13 |
| Method Of Mounting Die App 20200321311 - WATANABE; Osamu ; et al. | 2020-10-08 |
| Ptfe Sheet And Method For Mounting Die App 20200291548 - WATANABE; Osamu ; et al. | 2020-09-17 |
| Semiconductor Chip Mounting Apparatus And Semiconductor Chip Mounting Method App 20200251441 - Kind Code | 2020-08-06 |
| Bonding Apparatus And Bonding Method App 20200098721 - WATANABE; Osamu ; et al. | 2020-03-26 |
| Manufacturing method of semiconductor device Grant 10,566,307 - Hasegawa , et al. Feb | 2020-02-18 |
| Ball forming device, wire-bonding apparatus, and ball formation method Grant 10,410,992 - Hagiwara , et al. Sept | 2019-09-10 |
| Semiconductor Device And Method For Manufacturing Same App 20180323166 - HASEGAWA; Yuu ; et al. | 2018-11-08 |
| Method for producing semiconductor device, and wire-bonding apparatus Grant 9,922,952 - Hagiwara , et al. March 20, 2 | 2018-03-20 |
| Method For Producing Semiconductor Device, And Wire-bonding Apparatus App 20160365330 - HAGIWARA; Yoshihito ; et al. | 2016-12-15 |
| Ball Forming Device, Wire-bonding Apparatus, And Ball Formation Method App 20160351538 - HAGIWARA; YOSHIHITO ; et al. | 2016-12-01 |
| Wire Bonding Apparatus And Bonding Method App 20160163673 - HAGIWARA; Yoshihito ; et al. | 2016-06-09 |
| Wire bonding apparatus and bonding method Grant 9,337,166 - Hagiwara , et al. May 10, 2 | 2016-05-10 |
| Wire Bonding Apparatus And Bonding Method App 20140138426 - HAGIWARA; Yoshihito ; et al. | 2014-05-22 |
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