Hagiwara; Shinsuke

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hagiwara; Shinsuke.The latest application filed is for "liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same".

Company Profile

0.15.11

Hagiwara; Shinsuke - Chikusei JP
Hagiwara; Shinsuke - Ibaraki JP
Hagiwara; Shinsuke - Ibaraki-ken JP
Hagiwara; Shinsuke - Yokohama JP
Hagiwara; Shinsuke - Shimodate JP
Hagiwara; Shinsuke - Yokohama-shi JP
Hagiwara; Shinsuke - Chikusei-shi JP
Hagiwara; Shinsuke - Shimodate-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Liquid resin composition for electronic components and electronic component device Grant 8,232,355 - Takahashi , et al. July 31, 2	2012-07-31
Sealant for electronics of epoxy resin, aromatic amine, accelerator and inorganic filler Grant 7,981,977 - Tendou , et al. July 19, 2	2011-07-19
Liquid resin composition for electronic part sealing, and electronic part apparatus utilizing the same Grant 7,982,322 - Tsuchida , et al. July 19, 2	2011-07-19
Liquid Resin Composition For Electronic Part Sealing, And Electronic Part Apparatus Utilizing The Same App 20100014263 - Tsuchida; Satoru ; et al.	2010-01-21
Vehicle seat assembly Grant 7,637,571 - Okano , et al. December 29, 2	2009-12-29
Liquid Resin Composition for Electronic Components and Electronic Component Device App 20090286930 - Takahashi; Hisato ; et al.	2009-11-19
Liquid Resin Composition for Electronic Components and Electronic Component Device App 20090273070 - Tendou; Kazuyoshi ; et al.	2009-11-05
Encapsulant of epoxy resin, curing agent, and secondary aminosilane coupling agent or phosphate Grant 7,544,727 - Ikezawa , et al. June 9, 2	2009-06-09
Vehicle seat assembly App 20080211283 - Okano; Ritsuro ; et al.	2008-09-04
Epoxy resin molding material for sealing use and semiconductor device Grant 7,397,139 - Ikezawa , et al. July 8, 2	2008-07-08
Fabrication process of semiconductor package and semiconductor package Grant 7,187,072 - Fukutomi , et al. March 6, 2	2007-03-06
Epoxy resin molding material for sealing use and semiconductor device App 20060214153 - Ikezawa; Ryoichi ; et al.	2006-09-28
Encapsulating epoxy resin molding material and semiconductor device App 20060074150 - Ikezawa; Ryoichi ; et al.	2006-04-06
Fabrication process of semiconductor package and semiconductor package App 20040110319 - Fukutomi, Naoki ; et al.	2004-06-10
Fabrication process of semiconductor package and semiconductor package Grant 6,746,897 - Fukutomi , et al. June 8, 2	2004-06-08
Phenyl, naphthly or fluorene cyclopentyl epoxy resins Grant 6,713,589 - Sue , et al. March 30, 2	2004-03-30
Epoxy resin molding material for sealing App 20030201548 - Ikezawa, Ryoichi ; et al.	2003-10-30
Fabrication process of semiconductor package and semiconductor package App 20020094606 - Fukutomi, Naoki ; et al.	2002-07-18
Cyclopentylene compound and intermediate thereof, epoxy resin composition, molding material, and resin-encapsulated electronic device App 20020065386 - Sue, Haruaki ; et al.	2002-05-30
Fabrication process of semiconductor package and semiconductor package App 20020039808 - Fukutomi, Naoki ; et al.	2002-04-04
Phase-separated carboxyl group-containing elastomer modified phoenoxy resin optionally with epoxy resin Grant 6,235,842 - Kuwano , et al. May 22, 2	2001-05-22
Fabrication process of semiconductor package and semiconductor package Grant 5,976,912 - Fukutomi , et al. November 2, 1	1999-11-02
Semiconductor sealant of epoxy resin and organic polymer-grafted silicone polymer Grant 5,962,139 - Hagiwara , et al. October 5, 1	1999-10-05
Epoxy resin molding for sealing electronic parts containing organic polymer-grafted silicone Grant 5,739,217 - Hagiwara , et al. April 14, 1	1998-04-14
Method of producing boards for printed wiring Grant 5,449,480 - Kuriya , et al. September 12, 1	1995-09-12
Epoxy resin molding material for sealing of electronic component Grant 5,319,005 - Hagiwara , et al. June 7, 1	1994-06-07

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