loadpatents
Patent applications and USPTO patent grants for Hagihara; Masaaki.The latest application filed is for "reduced contaminant gas injection system and method of using".
Patent | Date |
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Reduced contaminant gas injection system and method of using Grant 7,743,731 - Enomoto , et al. June 29, 2 | 2010-06-29 |
Method and system for etching a high-k dielectric material Grant 7,709,397 - Chen , et al. May 4, 2 | 2010-05-04 |
Low-pressure removal of photoresist and etch residue Grant 7,700,494 - Balasubramaniam , et al. April 20, 2 | 2010-04-20 |
Etching method Grant 7,582,220 - Ishikawa , et al. September 1, 2 | 2009-09-01 |
Method and apparatus for bilayer photoresist dry development Grant 7,465,673 - Igarashi , et al. December 16, 2 | 2008-12-16 |
Low-pressure removal of photoresist and etch residue Grant 7,344,993 - Balasubramaniam , et al. March 18, 2 | 2008-03-18 |
Reduced contaminant gas injection system and method of using App 20070235136 - Enomoto; Takashi ;   et al. | 2007-10-11 |
Etching method and plasma processing method Grant 7,211,197 - Hagihara , et al. May 1, 2 | 2007-05-01 |
Method and system for etching silicon oxide and silicon nitride with high selectivity relative to silicon App 20070059938 - Kida; Hanako ;   et al. | 2007-03-15 |
Low-pressure removal of photoresist and etch residue App 20060154486 - Balasubramaniam; Vaidyanathan ;   et al. | 2006-07-13 |
Low-pressure removal of photoresist and etch residue App 20060144817 - Balasubramaniam; Vaidyanathan ;   et al. | 2006-07-06 |
Method and system for etching a high-k dielectric material App 20050164511 - Chen, Lee ;   et al. | 2005-07-28 |
Etching method and plasma processing method App 20050000939 - Hagihara, Masaaki ;   et al. | 2005-01-06 |
Method and apparatus for bilayer photoresist dry development App 20040185380 - Igarashi, Yoshiki ;   et al. | 2004-09-23 |
Method of etching and method of plasma treatment Grant 6,780,342 - Hagihara , et al. August 24, 2 | 2004-08-24 |
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