Hagen; Robert-Christian

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hagen; Robert-Christian.The latest application filed is for "lead frame with non-conductive connective bar".

Company Profile

0.23.27

Hagen; Robert-Christian - Sarching N/A DE
Hagen; Robert-Christian - Barbing DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device stack and method for its production Grant 8,659,135 - Bauer , et al. February 25, 2	2014-02-25
Lead frame with non-conductive connective bar Grant 7,795,712 - Tatt , et al. September 14, 2	2010-09-14
Semiconductor component with plastic housing, and process for producing the same Grant 7,772,105 - Bachmaier , et al. August 10, 2	2010-08-10
Base semiconductor component for a semiconductor component stack and method for the production thereof Grant 7,755,178 - Hagen , et al. July 13, 2	2010-07-13
Sensor component and panel used for the production thereof Grant 7,700,956 - Fuergut , et al. April 20, 2	2010-04-20
Smart card, smart card module, and a method for production of a smart card module Grant 7,575,173 - Fuergut , et al. August 18, 2	2009-08-18
Biosensor with smart card configuration Grant 7,566,968 - Bauer , et al. July 28, 2	2009-07-28
Plastic package and semiconductor component comprising such a plastic package, and method for its production Grant 7,554,196 - Bachmaier , et al. June 30, 2	2009-06-30
Electronic component and a panel Grant 7,524,699 - Fuergut , et al. April 28, 2	2009-04-28
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds Grant 7,517,722 - Goller , et al. April 14, 2	2009-04-14
Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same Grant 7,508,083 - Hagen , et al. March 24, 2	2009-03-24
Lead Frame with Non-Conductive Connective Bar App 20090051017 - Wee; Beng Tatt ; et al.	2009-02-26
Base Semiconductor Component For a Semiconductor Component Stack and Method For the Production Thereof App 20080284043 - Hagen; Robert-Christian ; et al.	2008-11-20
Electronic module having plug contacts and method for producing it Grant 7,391,103 - Fuergut , et al. June 24, 2	2008-06-24
Semiconductor Component with Plastic Housing, and Process for Producing the Same App 20080050907 - Bachmaier; Ulrich ; et al.	2008-02-28
Semiconductor component with plastic housing, and process for producing the same Grant 7,327,023 - Bachmaier , et al. February 5, 2	2008-02-05
Semiconductor Device Stack and Method for Its Production App 20070278639 - Bauer; Michael ; et al.	2007-12-06
Electronic component with a plastic package and method for production Grant 7,276,783 - Goller , et al. October 2, 2	2007-10-02
Sensor component and panel used for the production thereof App 20070128754 - Fuergut; Edward ; et al.	2007-06-07
Electronic component with a stack of semiconductor chips and a method for producing the electronic component Grant 7,190,059 - Hagen , et al. March 13, 2	2007-03-13
Method of producing a universal semiconductor housing with precrosslinked plastic embedding compounds App 20060258046 - Goller; Bernd ; et al.	2006-11-16
Electronic component comprising a semiconductor chip and a plastic housing, and method for producing the same App 20060255478 - Hagen; Robert-Christian ; et al.	2006-11-16
Method for producing an electronic component with shielding App 20060183306 - Hagen; Robert-Christian ; et al.	2006-08-17
Smart card, smart card module, and a method for production of a smart card module App 20060175419 - Fuergut; Edward ; et al.	2006-08-10
Electronic component and panel for producing the same App 20060125042 - Fuergut; Edward ; et al.	2006-06-15
Electronic component with shielding and method for its production Grant 7,045,881 - Hagen , et al. May 16, 2	2006-05-16
Plastic package and semiconductor component comprising such a plastic package, and method for its production App 20060091522 - Bachmaier; Ulrich ; et al.	2006-05-04
Semiconductor component with plastic housing, and process for producing the same App 20060076667 - Bachmaier; Ulrich ; et al.	2006-04-13
Biosensor with smart card configuration App 20060027905 - Bauer; Michael ; et al.	2006-02-09
Electronic component with at least one semiconductor chip and method for its manufacture Grant 6,953,992 - Goller , et al. October 11, 2	2005-10-11
Method for producing channels and cavities in semiconductor housings, and an electronic component having such channels and cavities Grant 6,949,405 - Hagen September 27, 2	2005-09-27
Electronic device configured as a multichip module, leadframe and panel with leadframe positions App 20050184375 - Goller, Bernd ; et al.	2005-08-25
Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device Grant 6,902,951 - Goller , et al. June 7, 2	2005-06-07
Electronic module having plug contacts and method for producing it App 20050087851 - Fuergut, Edward ; et al.	2005-04-28
Universal package for an electronic component with a semiconductor chip and method for producing the universal package Grant 6,867,471 - Goller , et al. March 15, 2	2005-03-15
Electronic component with a plastic housing and method for production thereof App 20040232543 - Goller, Bernd ; et al.	2004-11-25
Electronic device configured as a multichip module, leadframe, panel with leadframe positions, and method for producing the electronic device App 20040140559 - Goller, Bernd ; et al.	2004-07-22
Method for producing channels and cavities in semiconductor housings, and an electronic component having such channels and cavities App 20040067603 - Hagen, Robert-Christian	2004-04-08
Electronic component with a stack of semiconductor chips and a method for producing the electronic component App 20040063304 - Hagen, Robert-Christian ; et al.	2004-04-01
Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component Grant 6,710,455 - Goller , et al. March 23, 2	2004-03-23
Universal package for an electronic component with a semiconductor chip and method for producing the universal package App 20040041251 - Goller, Bernd ; et al.	2004-03-04
Universal semiconductor housing with precrosslinked plastic embedding compounds, and method of producing the semiconductor housing App 20040043515 - Goller, Bernd ; et al.	2004-03-04
Electronic component and process for producing the electronic component Grant 6,683,374 - Goller , et al. January 27, 2	2004-01-27
Electronic component with at least one semiconductor chip and method for its manufacture App 20030071336 - Goller, Bernd ; et al.	2003-04-17
Electronic component with at least two stacked semiconductor chips and method for fabricating the electronic component App 20030047813 - Goller, Bernd ; et al.	2003-03-13
Electronic component and process for producing the electronic component App 20030042590 - Goller, Bernd ; et al.	2003-03-06
Electronic component with at least two stacked semiconductor chips and process for producing the electronic component App 20030043555 - Goller, Bernd ; et al.	2003-03-06
Electronic component with at least two stacked semiconductor chips, and fabrication method App 20030042591 - Goller, Bernd ; et al.	2003-03-06
Electronic component with shielding and method for its production App 20020081819 - Hagen, Robert-Christian ; et al.	2002-06-27

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