loadpatents
name:-0.002424955368042
name:-0.0044770240783691
name:-0.00045299530029297
Hagen; Deborah A. Patent Filings

Hagen; Deborah A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hagen; Deborah A..The latest application filed is for "wirebonded assemblage method and apparatus".

Company Profile
0.4.2
  • Hagen; Deborah A. - Austin TX
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor package and method therefor
Grant 7,927,927 - Quan , et al. April 19, 2
2011-04-19
Wirebonded assemblage method and apparatus
Grant 7,088,009 - Hagen August 8, 2
2006-08-08
Wirebonded assemblage method and apparatus
App 20050040501 - Hagen, Deborah A.
2005-02-24
Method and apparatus for manufacturing an interconnect structure
Grant 6,429,531 - Mistry , et al. August 6, 2
2002-08-06
Semiconductor package and method therefor
App 20020053452 - Quan, Son Ky ;   et al.
2002-05-09
Semiconductor package and method thereof
Grant 5,776,798 - Quan , et al. July 7, 1
1998-07-07

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