Haga; Kouji

Patent Applications and Registrations

Patent applications and USPTO patent grants for Haga; Kouji.The latest application filed is for "polishing liquid for metal and polishing method".

Company Profile

0.14.14

Haga; Kouji - Ibaraki JP
Haga; Kouji - Hitachi N/A JP
Haga; Kouji - Hitachi-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Polishing liquid for metal and polishing method Grant 10,037,894 - Ichige , et al. July 31, 2	2018-07-31
Polishing Liquid For Metal And Polishing Method App 20140370707 - Ichige; Yasuhiro ; et al.	2014-12-18
CMP polishing slurry and method of polishing substrate Grant 8,900,335 - Fukasawa , et al. December 2, 2	2014-12-02
Polishing solution for metal films and polishing method using the same Grant 8,734,204 - Haga , et al. May 27, 2	2014-05-27
Polishing Liquid For Metal Film And Polishing Method App 20130217229 - Haga; Kouji ; et al.	2013-08-22
Polishing liquid for metal film and polishing method Grant 8,501,625 - Haga , et al. August 6, 2	2013-08-06
Polishing slurry for chemical mechanical polishing and method for polishing substrate Grant 8,231,735 - Haga , et al. July 31, 2	2012-07-31
CMP polishing slurry and polishing method Grant 8,168,541 - Fukasawa , et al. May 1, 2	2012-05-01
CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive Grant 8,002,860 - Koyama , et al. August 23, 2	2011-08-23
Polishing Solution For Metal Films And Polishing Method Using The Same App 20110104992 - Haga; Kouji ; et al.	2011-05-05
Cmp Polishing Slurry And Polishing Method App 20110028073 - Fukasawa; Masato ; et al.	2011-02-03
Polishing Liquid For Metal Film And Polishing Method App 20100323584 - Haga; Kouji ; et al.	2010-12-23
CMP polishing slurry and polishing method Grant 7,837,800 - Fukasawa , et al. November 23, 2	2010-11-23
CMP polishing compound and polishing method Grant 7,838,482 - Fukasawa , et al. November 23, 2	2010-11-23
Cmp Polishing Slurry And Method Of Polishing Substrate App 20100210109 - Fukasawa; Masato ; et al.	2010-08-19
Cmp Abrasive, Method For Polishing Substrate And Method For Manufacturing Semiconductor Device Using The Same, And Additive For Cmp Abrasive App 20090253355 - Koyama; Naoyuki ; et al.	2009-10-08
Cmp Polishing Slurry and Method of Polishing Substrate App 20080254717 - Fukasawa; Masato ; et al.	2008-10-16
CMP polishing slurry and polishing method App 20080214093 - Fukasawa; Masato ; et al.	2008-09-04
Abrasive compound for CMP, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive compound Grant 7,410,409 - Koyama , et al. August 12, 2	2008-08-12
Polishing slurry for chemical mechanical polishing and method for polishing substrate App 20080176982 - Haga; Kouji ; et al.	2008-07-24
Cmp Polishing Slurry and Method of Polishing Substrate App 20080003925 - Fukasawa; Masato ; et al.	2008-01-03
Polishing slurry for chemical mechanical polishing and method for polishing substrate Grant 7,311,855 - Haga , et al. December 25, 2	2007-12-25
CMP abrasive, method for polishing substrate and method for manufacturing semiconductor device using the same, and additive for CMP abrasive App 20070169421 - Koyama; Naoyuki ; et al.	2007-07-26
Cmp polishing compound and polishing method App 20060148667 - Fukasawa; Masato ; et al.	2006-07-06
Polishing slurry for chemical mechanical polishing and method for polishing substrate App 20060124591 - Haga; Kouji ; et al.	2006-06-15

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