Haga; Chris
Patent Applications and Registrations
Patent applications and USPTO patent grants for Haga; Chris.The latest application filed is for "thermally enhanced bga package with ground ring".
- Haga; Chris - McKinney TX
| Patent | Date |
|---|---|
| Thermally enhanced BGA package with ground ring Grant 7,498,203 - Haga , et al. March 3, 2 | 2009-03-03 |
| Thermally enhanced BGA package with ground ring App 20070246823 - Haga; Chris ; et al. | 2007-10-25 |
| Closed loop thermally enhanced flip chip BGA App 20070090533 - Haga; Chris ; et al. | 2007-04-26 |
| Semiconductor Package Having Integrated Metal Parts for Thermal Enhancement App 20060226521 - Coyle; Anthony L. ; et al. | 2006-10-12 |
| Semiconductor package having integrated metal parts for thermal enhancement Grant 7,084,494 - Coyle , et al. August 1, 2 | 2006-08-01 |
| Semiconductor package having integrated metal parts for thermal enhancement App 20050280124 - Coyle, Anthony L. ; et al. | 2005-12-22 |
| Wafer-level assembly method for chip-size devices having flipped chips App 20050151268 - Boyd, William D. ; et al. | 2005-07-14 |
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