Haga; Akiko
Patent Applications and Registrations
Patent applications and USPTO patent grants for Haga; Akiko.The latest application filed is for "heat-shrinkable cylindrical label, long cylindrical body, and cylindrical-label-attached article".
- Haga; Akiko - Tokyo JP
- Haga; Akiko - Osaka JP
- Haga; Akiko - Osaka-shi Osaka JP
| Patent | Date |
|---|---|
| Heat-shrinkable cylindrical label, long cylindrical body, and cylindrical-label-attached article Grant 8,173,231 - Hikida , et al. May 8, 2 | 2012-05-08 |
| Heat-shrinkable Cylindrical Label, Long Cylindrical Body, And Cylindrical-label-attached Article App 20110052846 - Hikida; Eiji ; et al. | 2011-03-03 |
| Shrinkable Label Having A Hologram Layer And Container With The Label App 20100178438 - Hikida; Eiji ; et al. | 2010-07-15 |
| Shrinkable Label Having A Hologram Layer And Container With The Label App 20100173229 - Hikida; Eiji ; et al. | 2010-07-08 |
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