Haehn; Nicholas
Patent Applications and Registrations
Patent applications and USPTO patent grants for Haehn; Nicholas.The latest application filed is for "dummy die structures of a packaged integrated circuit device".
- Haehn; Nicholas - Scottsdale AZ
| Patent | Date |
|---|---|
| Dummy Die Structures Of A Packaged Integrated Circuit Device App 20220102242 - Modi; Mitul ; et al. | 2022-03-31 |
| Dummy Die In A Recessed Mold Structure Of A Packaged Integrated Circuit Device App 20220102231 - Modi; Mitul ; et al. | 2022-03-31 |
| Method, Device And System For Providing Etched Metallization Structures App 20210289638 - Ecton; Jeremy ; et al. | 2021-09-16 |
| Method, device and system for providing etched metallization structures Grant 11,116,084 - Ecton , et al. September 7, 2 | 2021-09-07 |
| Method, Device And System For Providing Etched Metallization Structures App 20200236795 - Ecton; Jeremy ; et al. | 2020-07-23 |
| Thermal Management Solutions For Cored Substrates App 20200203256 - Neal; Nicholas ; et al. | 2020-06-25 |
| Substrate Thermal Layer For Heat Spreader Connection App 20200118902 - Neal; Nicholas ; et al. | 2020-04-16 |
| Alignment Via-trace Structures App 20190304890 - Ecton; Jeremy ; et al. | 2019-10-03 |
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