Hada; Sayuri

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hada; Sayuri.The latest application filed is for "reduction of stress in via structure".

Company Profile

6.12.13

Hada; Sayuri - Kanagawa JP
Hada; Sayuri - Kawasaki JP
Hada; Sayuri - Tokyo JP
HADA; Sayuri - Sagamihara JP
Hada; Sayuri - Machida JP
Hada; Sayuri - Machida-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Circuit module and manufacturing method thereof Grant 10,679,916 - Horibe , et al.	2020-06-09
Reduction of stress in via structure Grant 10,593,616 - Aoki , et al.	2020-03-17
Method of reducing warpage of an organic substrate Grant 10,595,399 - Hada , et al.	2020-03-17
Reduction Of Stress In Via Structure App 20190214339 - Aoki; Toyohiro ; et al.	2019-07-11
Reduction of stress in via structure Grant 10,325,839 - Aoki , et al.	2019-06-18
Method Of Reducing Warpage Of An Organic Substrate App 20190053370 - Hada; Sayuri ; et al.	2019-02-14
Circuit Module And Manufacturing Method Thereof App 20180366388 - HORIBE; Akihiro ; et al.	2018-12-20
Reduction Of Stress In Via Structure App 20180294214 - Aoki; Toyohiro ; et al.	2018-10-11
Reduction Of Stress In Via Structure App 20180294213 - Aoki; Toyohiro ; et al.	2018-10-11
Circuit module and manufacturing method thereof Grant 10,074,583 - Horibe , et al. September 11, 2	2018-09-11
Method of reducing warpage of an orgacnic substrate Grant 9,967,971 - Hada , et al. May 8, 2	2018-05-08
Reduction of warpage of multilayered substrate or package Grant 9,672,323 - Hada , et al. June 6, 2	2017-06-06
Method Of Reducing Warpage Of An Orgacnic Substrate App 20170142825 - Hada; Sayuri ; et al.	2017-05-18
Method, apparatus, and structure for determining interposer thickness Grant 9,568,405 - Hada , et al. February 14, 2	2017-02-14
Reduction Of Warpage Of Multilayered Substrate Or Package App 20160217247 - Hada; Sayuri ; et al.	2016-07-28
Reduction of warpage of multilayered substrate or package Grant 9,384,314 - Hada , et al. July 5, 2	2016-07-05
Circuit Module And Manufacturing Method Thereof App 20160141218 - HORIBE; Akihiro ; et al.	2016-05-19
Sheet having high thermal conductivity and flexibility Grant 9,179,579 - Hada , et al. November 3, 2	2015-11-03
Reduction Of Warpage Of Multilayered Substrate Or Package App 20150248516 - Hada; Sayuri ; et al.	2015-09-03
Mounting structure and mounting structure manufacturing method Grant 9,099,315 - Hada , et al. August 4, 2	2015-08-04
Method, Apparatus, And Structure For Determining Interposer Thickness App 20150153406 - Hada; Sayuri ; et al.	2015-06-04
Mounting Structure And Mounting Structure Manufacturing Method App 20150021777 - Hada; Sayuri ; et al.	2015-01-22
Method For Forming Studs Used For Self-alignment Of Solder Bumps App 20130119536 - Hada; Sayuri ; et al.	2013-05-16
Sheet Having High Thermal Conductivity And Flexibility App 20110198067 - Hada; Sayuri ; et al.	2011-08-18

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