Hackenberg; Ken P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Hackenberg; Ken P..The latest application filed is for "full package vapor chamber with ihs".

Company Profile

7.3.7

Hackenberg; Ken P. - Tempe AZ
HACKENBERG; Ken P. - Plano TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-chip packages and sinterable paste for use with thermal interface materials Grant 11,404,349 - Raravikar , et al. August 2, 2	2022-08-02
Full Package Vapor Chamber With Ihs App 20210195798 - NEAL; Nicholas ; et al.	2021-06-24
Sintered solder for fine pitch first-level interconnect (FLI) applications Grant 10,515,914 - Oka , et al. Dec	2019-12-24
Multi-chip Packages And Sinterable Paste For Use With Thermal Interface Materials App 20190267306 - RARAVIKAR; Nachiket R. ; et al.	2019-08-29
Sintered Solder For Fine Pitch First-level Interconnect (fli) Applications App 20190157225 - OKA; Mihir A. ; et al.	2019-05-23
Compressible Media Applicator, Application System And Methods For Same App 20190099776 - Hackenberg; Ken P. ; et al.	2019-04-04
Compressible Media Applicator, Application System And Methods For Same App 20190099777 - Hackenberg; Ken P. ; et al.	2019-04-04
Sintered solder for fine pitch first-level interconnect (FLI) applications Grant 10,224,299 - Oka , et al.	2019-03-05
Sintered Solder For Fine Pitch First-level Interconnect (fli) Applications App 20180190604 - OKA; Mihir A. ; et al.	2018-07-05

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