Habu; Takashi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Habu; Takashi.The latest application filed is for "soft magnetic resin composition and soft magnetic film".

Company Profile

2.7.16

Habu; Takashi - Osaka JP
- Osaka JP
Habu; Takashi - Ibaraki N/A JP
HABU; Takashi - Ibaraki-shi JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device Grant 10,418,161 - Masuda , et al. Sept	2019-09-17
Soft magnetic particle powder, soft magnetic resin composition, soft magnetic film, soft magnetic film laminated circuit board, and position detection device Grant 10373749 -	2019-08-06
Soft magnetic resin composition and soft magnetic film Grant 10,269,477 - Matsutomi , et al.	2019-04-23
Method for producing soft magnetic film laminate circuit board Grant 9,844,147 - Habu , et al. December 12, 2	2017-12-12
Soft Magnetic Resin Composition And Soft Magnetic Film App 20170110231 - MATSUTOMI; Akihito ; et al.	2017-04-20
Soft Magnetic Resin Composition And Soft Magnetic Film App 20160268026 - MATSUTOMI; Akihito ; et al.	2016-09-15
Soft Magnetic Resin Composition And Soft Magnetic Film App 20160247612 - EBE; Hirofumi ; et al.	2016-08-25
Soft Magnetic Particle Powder, Soft Magnetic Resin Composition, Soft Magnetic Film, Soft Magnetic Film Laminated Circuit Board, And Position Detection Device App 20160211061 - MASUDA; Shotaro ; et al.	2016-07-21
Soft Magnetic Resin Composition, Soft Magnetic Adhesive Film, Soft Magnetic Film Laminate Circuit Board, And Position Detection Device App 20160172086 - HABU; Takashi ; et al.	2016-06-16
Method For Producing Soft Magnetic Film Laminate Circuit Board App 20160105969 - HABU; Takashi ; et al.	2016-04-14
Soft Magnetic Thermosetting Adhesive Film, Magnetic Film Laminate Circuit Board, And Position Detection Device App 20160083626 - EBE; Hirofumi ; et al.	2016-03-24
Pressure-sensitive adhesive sheet for protecting semiconductor wafer Grant 8,546,958 - Habu , et al. October 1, 2	2013-10-01
Substrate-less pressure-sensitive adhesive sheet for protection of semiconductor wafer, method for grinding back side of semiconductor wafer using pressure-sensitive adhesive sheet, and method for producing pressure-sensitive adhesive sheet Grant 8,388,786 - Habu , et al. March 5, 2	2013-03-05
Pressure-sensitive Adhesive Tape App 20120070661 - IKISHIMA; Shinsuke ; et al.	2012-03-22
Pressure-sensitive Adhesive Tape App 20120070658 - IKISHIMA; Shinsuke ; et al.	2012-03-22
Viscoelastic Body And Method For Manufacturing The Same App 20120065350 - HABU; Takashi ; et al.	2012-03-15
Pressure-sensitive Adhesive Sheet For Protecting Semiconductor Wafer App 20120056338 - HABU; Takashi ; et al.	2012-03-08
Pressure-sensitive Adhesive Sheet For Protecting Semiconductor Wafer App 20120058319 - YAMAMOTO; Akiyoshi ; et al.	2012-03-08
Re-peelable Adhesive Sheet App 20110097576 - HABU; Takashi ; et al.	2011-04-28
Substrate-less Pressure-sensitive Adhesive Sheet For Protection Of Semiconductor Wafer, Method For Grinding Back Side Of Semiconductor Wafer Using Pressure-sensitive Adhesive Sheet, And Method For Producing Pressure-sensitive Adhesive Sheet App 20100230036 - HABU; Takashi ; et al.	2010-09-16
Re-releasable Adhesive Agent And Re-releasable Adhesive Sheet App 20100028669 - HABU; Takashi ; et al.	2010-02-04
Patch and patch preparation App 20090010995 - Hamada; Atsushi ; et al.	2009-01-08

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