loadpatents
name:-0.017358064651489
name:-0.006371021270752
name:-0.0017170906066895
Haba; Toshio Patent Filings

Haba; Toshio

Patent Applications and Registrations

Patent applications and USPTO patent grants for Haba; Toshio.The latest application filed is for "fine pattern mold".

Company Profile
0.5.14
  • Haba; Toshio - Tokai N/A JP
  • Haba; Toshio - Naka JP
  • Haba, Toshio - Hitachi JP
  • Haba, Toshio - Hitachi-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Fine pattern mold
Grant 8,387,255 - Ogino , et al. March 5, 2
2013-03-05
Fine Pattern Mold
App 20120067507 - OGINO; Masahiko ;   et al.
2012-03-22
Fine pattern mold
Grant 8,083,515 - Ogino , et al. December 27, 2
2011-12-27
Lithium Secondary Battery
App 20110143196 - OKUMURA; Takefumi ;   et al.
2011-06-16
Electronic Circuit Component And Method For Manufacturing Same
App 20110114368 - Nakano; Hiroshi ;   et al.
2011-05-19
Metal structure and method of its production
Grant 7,922,887 - Haba , et al. April 12, 2
2011-04-12
Copper Circuit Wiring Board And Method For Manufacturing The Same
App 20100181100 - NAKANO; Hiroshi ;   et al.
2010-07-22
Production Method For Wiring And Vias
App 20090057156 - Haba; Toshio ;   et al.
2009-03-05
Fine Pattern Mold and Method for Producing the Same
App 20080299247 - Ogino; Masahiko ;   et al.
2008-12-04
Wiring Board and Production Method Thereof
App 20080251387 - Haba; Toshio ;   et al.
2008-10-16
Production Method Of Conductive Pattern
App 20070287289 - Haba; Toshio ;   et al.
2007-12-13
Metal structure and method of its production
App 20060180472 - Haba; Toshio ;   et al.
2006-08-17
Wiring board and production method thereof
App 20060163725 - Haba; Toshio ;   et al.
2006-07-27
Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same
App 20050087447 - Haba, Toshio ;   et al.
2005-04-28
Plating method, plating solution, semiconductor device and process for producing the same
App 20030085467 - Kobayashi, Kinya ;   et al.
2003-05-08
Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same
App 20020084191 - Haba, Toshio ;   et al.
2002-07-04
Semiconductor device having wires and insulator layers with via-studs
App 20020030283 - Itabashi, Takeyuki ;   et al.
2002-03-14
Semiconductor device and method of manufacturing the same
Grant 6,300,244 - Itabashi , et al. October 9, 2
2001-10-09

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