Haas, David R.
Patent Applications and Registrations
Patent applications and USPTO patent grants for Haas, David R..The latest application filed is for "lasable bond-ply materials for high density printed wiring boards".
- Haas, David R. - Westfield NJ
- Haas; David R. - New York NY
| Patent | Date |
|---|---|
| Lasable bond-ply materials for high density printed wiring boards App 20040170795 - Haas, David R. ; et al. | 2004-09-02 |
| Lasable bond-ply materials for high density printed wiring boards Grant 6,245,696 - Haas , et al. June 12, 2 | 2001-06-12 |
| Microfiber dielectrics which facilitate laser via drilling Grant 6,224,965 - Haas , et al. May 1, 2 | 2001-05-01 |
| Polarization-insensitive linear waveguide electrooptic phase modulator Grant 4,932,737 - Yoon , et al. June 12, 1 | 1990-06-12 |
| Polarization-insensitive interferometric waveguide electrooptic modulator Grant 4,932,738 - Haas , et al. June 12, 1 | 1990-06-12 |
| Frequency doubling polymeric waveguide Grant 4,865,406 - Khanarian , et al. September 12, 1 | 1989-09-12 |
| SEC | 0001282689 | HAAS DAVID R |
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