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Patent applications and USPTO patent grants for Haapala; John A..The latest application filed is for "methods of bonding metal surfaces, and components therefor".
Patent | Date |
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Methods of bonding metal surfaces, and components therefor Grant 7,143,895 - Autterson , et al. December 5, 2 | 2006-12-05 |
Fabricated tape assembly Grant 6,808,774 - Autterson , et al. October 26, 2 | 2004-10-26 |
Methods of bonding metal surfaces, and components therefor Grant 6,736,925 - Autterson , et al. May 18, 2 | 2004-05-18 |
Locating door hinge washer device for hinge assembly Grant 6,669,428 - Autterson , et al. December 30, 2 | 2003-12-30 |
Methods of bonding metal surfaces, and components therefor App 20020176985 - Autterson, Christopher S. ;   et al. | 2002-11-28 |
Methods of bonding metal surfaces, and components therefor App 20020175104 - Autterson, Christopher S. ;   et al. | 2002-11-28 |
Methods of bonding metal surfaces, and components therefor App 20020170669 - Autterson, Christopher S. ;   et al. | 2002-11-21 |
Methods of bonding metal surfaces, and components therefor App 20020056517 - Autterson, Christopher S. ;   et al. | 2002-05-16 |
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