Ha; Yongdae
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ha; Yongdae.The latest application filed is for "bonding head and a bonding apparatus having the same".
- Ha; Yongdae - Suwon-si KR
- Ha; Yongdae - Asan-si KR
| Patent | Date |
|---|---|
| Bonding head and a bonding apparatus having the same Grant 11,456,273 - Kim , et al. September 27, 2 | 2022-09-27 |
| Bonding Head And A Bonding Apparatus Having The Same App 20200343215 - KIM; JAECHEOL ; et al. | 2020-10-29 |
| Chuck table and substrate processing system including the same Grant 10,211,084 - Kim , et al. Feb | 2019-02-19 |
| Die bonding apparatus Grant 9,698,117 - Ha , et al. July 4, 2 | 2017-07-04 |
| Chuck Table And Substrate Processing System Including The Same App 20170040202 - KIM; DOOJIN ; et al. | 2017-02-09 |
| Die bonding device Grant 9,455,165 - Hwang , et al. September 27, 2 | 2016-09-27 |
| Die Bonding Device App 20150303081 - Hwang; Yisung ; et al. | 2015-10-22 |
| Die Bonding Apparatus App 20150228612 - HA; Yongdae ; et al. | 2015-08-13 |
| Die Ejector And Die Separation Method App 20140238618 - HWANG; Yisung ; et al. | 2014-08-28 |
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