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Patent applications and USPTO patent grants for Ha; Seungweon.The latest application filed is for "bonding wire, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire".
Patent | Date |
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Bonding wire having a silver alloy core, wire bonding method using the bonding wire, and electrical connection part of semiconductor device using the bonding wire Grant 10,658,326 - Han , et al. | 2020-05-19 |
Bonding Wire, Wire Bonding Method Using The Bonding Wire, And Electrical Connection Part Of Semiconductor Device Using The Bonding Wire App 20180026004 - HAN; WON-GIL ;   et al. | 2018-01-25 |
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