HA; Sangsu

Patent Applications and Registrations

Patent applications and USPTO patent grants for HA; Sangsu.The latest application filed is for "package substrate and semiconductor package including the same".

Company Profile

1.3.6

HA; Sangsu - Suwon-si KR
HA; Sangsu - Gumi-si KR
Ha; Sangsu - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Package Substrate And Semiconductor Package Including The Same App 20220285290 - KIM; Byungwook ; et al.	2022-09-08
Package substrate and semiconductor package including the same Grant 11,342,283 - Kim , et al. May 24, 2	2022-05-24
Interconnect Structure And Semiconductor Chip Including The Same App 20220052005 - KIM; Byungwook ; et al.	2022-02-17
Method for compensating for pressure value of force sensor and electronic device using same Grant 11,068,150 - Ha , et al. July 20, 2	2021-07-20
Package Substrate And Semiconductor Package Including The Same App 20210050308 - KIM; Byungwook ; et al.	2021-02-18
Method For Compensating For Pressure Value Of Force Sensor And Electronic Device Using Same App 20200264751 - HA; Sangsu ; et al.	2020-08-20
Electronic Device And Method Of Receiving User Input Thereof App 20170285842 - KIM; Byungchul ; et al.	2017-10-05
Semiconductor package having magnetic connection member Grant 9,402,315 - Chun , et al. July 26, 2	2016-07-26
Semiconductor Package Having Magnetic Connection Member App 20150115468 - CHUN; Hyunsuk ; et al.	2015-04-30

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