HA; Jong Woo

Patent Applications and Registrations

Patent applications and USPTO patent grants for HA; Jong Woo.The latest application filed is for "manufacturing method of ceramic chips".

Company Profile

2.72.61

HA; Jong Woo - Seoul KR
- Seoul KR
Ha; Jong-Woo - Singapore SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Manufacturing Method Of Ceramic Chips App 20210122083 - LEE; Sung Yoon ; et al.	2021-04-29
Duplexer Grant 9,768,485 - Cho , et al. September 19, 2	2017-09-19
Filter Package App 20160164162 - CHO; Hak Rae ; et al.	2016-06-09
Integrated circuit package stacking system with redistribution and method of manufacture thereof Grant 9,355,962 - Lee , et al. May 31, 2	2016-05-31
Duplexer App 20160134005 - CHO; Hak Rae ; et al.	2016-05-12
Integrated circuit package system with multi-chip module Grant 9,330,945 - Song , et al. May 3, 2	2016-05-03
Portable communication terminal for extracting subjects of interest to the user, and a method therefor Grant 9,323,845 - Lee , et al. April 26, 2	2016-04-26
Method And Apparatus For Providing Internet Service In Mobile Communication Terminal App 20160036928 - Lee; Jeong-Soo ; et al.	2016-02-04
Stacked integrated circuit package system Grant 9,236,319 - Ha , et al. January 12, 2	2016-01-12
Integrated circuit packaging system with package-on-package and method of manufacture thereof Grant 9,230,898 - Shin , et al. January 5, 2	2016-01-05
Integrated circuit package system with support carrier and method of manufacture thereof Grant 8,987,056 - Ha , et al. March 24, 2	2015-03-24
Integrated circuit packaging system with embedded circuitry and post Grant 8,957,530 - Shim , et al. February 17, 2	2015-02-17
Integrated circuit package system having cavity Grant 8,823,160 - Ha , et al. September 2, 2	2014-09-02
Stacked integrated circuit package system with face to face stack configuration Grant 8,810,018 - Ha , et al. August 19, 2	2014-08-19
Integrated circuit package system with waferscale spacer Grant 8,692,388 - Lee , et al. April 8, 2	2014-04-08
Dual-die package structure having dies externally and simultaneously connected via bump electrodes and bond wires Grant 8,642,383 - Ha , et al. February 4, 2	2014-02-04
Integrated circuit packaging system with step mold and method of manufacture thereof Grant 8,633,058 - Choi , et al. January 21, 2	2014-01-21
Stacked integrated circuit package-in-package system and method of manufacture thereof Grant 08617924 -	2013-12-31
Stacked integrated circuit package-in-package system and method of manufacture thereof Grant 8,617,924 - Kim , et al. December 31, 2	2013-12-31
Integrated circuit packaging system with ultra-thin die Grant 8,581,380 - Park , et al. November 12, 2	2013-11-12
Planar encapsulation and mold cavity package in package system Grant 8,531,043 - Ha , et al. September 10, 2	2013-09-10
Integrated circuit packaging system with lead frame stacking module and method of manufacture thereof Grant 8,481,420 - Ha , et al. July 9, 2	2013-07-09
Integrated circuit packaging system with stacked configuration and method of manufacture thereof Grant 8,405,197 - Ha , et al. March 26, 2	2013-03-26
Portable Communication Terminal For Extracting Subjects Of Interest To The User, And A Method Therefor App 20130073569 - Lee; Sang Keun ; et al.	2013-03-21
Integrated circuit package system employing an offset stacked configuration and method for manufacturing thereof Grant 8,383,458 - Choi , et al. February 26, 2	2013-02-26
Integrated Circuit Package System With Waferscale Spacer App 20120261810 - Lee; Sang-Ho ; et al.	2012-10-18
Integrated Circuit Packaging System With Step Mold And Method Of Manufacture Thereof App 20120241979 - Choi; DaeSik ; et al.	2012-09-27
Integrated Circuit Packaging System With Lead Frame Stacking Module And Method Of Manufacture Thereof App 20120235307 - Ha; Jong-Woo ; et al.	2012-09-20
Integrated circuit packaging system with mountable inward and outward interconnects and method of manufacture thereof Grant 8,241,955 - Pagaila , et al. August 14, 2	2012-08-14
Integrated circuit packaging system with lead frame and method of manufacture thereof Grant 8,211,746 - Ha , et al. July 3, 2	2012-07-03
Integrated circuit package system with waferscale spacer Grant 8,211,749 - Lee , et al. July 3, 2	2012-07-03
Method for manufacturing ball grid array package stacking system Grant 8,143,104 - Ha March 27, 2	2012-03-27
Method For Manufacturing Ball Grid Array Package Stacking System App 20120028413 - Ha; Jong-Woo	2012-02-02
Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof Grant 8,093,727 - Park , et al. January 10, 2	2012-01-10
Stacked integrated circuit package system and method for manufacturing thereof Grant 8,067,268 - Carson , et al. November 29, 2	2011-11-29
Integrated circuit package-in-package system and method for making thereof Grant 8,049,322 - Yim , et al. November 1, 2	2011-11-01
Integrated Circuit Packaging System With Mountable Inward And Outward Interconnects And Method Of Manufacture Thereof App 20110256664 - Pagaila; Reza Argenty ; et al.	2011-10-20
Integrated circuit package system including wafer level spacer Grant 8,039,365 - Lee , et al. October 18, 2	2011-10-18
Ball grid array package stacking system Grant 8,039,942 - Ha October 18, 2	2011-10-18
Integrated Circuit Packaging System With Lead Frame And Method Of Manufacture Thereof App 20110227206 - Ha; Jong-Woo ; et al.	2011-09-22
Integrated circuit packaging system having an internal structure protrusion and method of manufacture thereof Grant 7,994,625 - Choi , et al. August 9, 2	2011-08-09
Integrated circuit package on package system Grant 7,968,373 - Ha , et al. June 28, 2	2011-06-28
Integrated Circuit Packaging System With Embedded Circuitry And Post App 20110127678 - Shim; Il Kwon ; et al.	2011-06-02
Integrated circuit packaging system with lead frame and method of manufacture thereof Grant 7,951,643 - Ha , et al. May 31, 2	2011-05-31
Integrated circuit packaging system with inward and outward interconnects and method of manufacture thereof Grant 7,927,917 - Pagaila , et al. April 19, 2	2011-04-19
Integrated Circuit Package System Employing An Offset Stacked Configuration And Method For Manufacturing Thereof App 20110084373 - Choi; DaeSik ; et al.	2011-04-14
Integrated circuit packaging system with base structure device Grant 7,915,724 - Ha , et al. March 29, 2	2011-03-29
Integrated Circuit Packaging System With Package-on-package And Method Of Manufacture Thereof App 20110037157 - Shin; HanGil ; et al.	2011-02-17
Integrated circuit packaging system with embedded circuitry and post, and method of manufacture thereof Grant 7,888,184 - Shim , et al. February 15, 2	2011-02-15
Integrated circuit packaging system with carrier and method of manufacture thereof Grant 7,884,460 - Yim , et al. February 8, 2	2011-02-08
Integrated circuit package system employing an offset stacked configuration Grant 7,872,340 - Choi , et al. January 18, 2	2011-01-18
Integrated Circuit Package-in-package System With Side-by-side And Offset Stacking And Method For Manufacturing Thereof App 20100320621 - Park; Soo-San ; et al.	2010-12-23
Integrated Circuit Packaging System With Inward And Outward Interconnects And Method Of Manufacture Thereof App 20100320582 - Pagaila; Reza Argenty ; et al.	2010-12-23
Integrated Circuit Package Stacking System With Redistribution And Method Of Manufacture Thereof App 20100314741 - Lee; SeongMin ; et al.	2010-12-16
Integrated circuit package system with net spacer Grant 7,829,986 - Lee , et al. November 9, 2	2010-11-09
Integrated circuit package-in-package system with side-by-side and offset stacking Grant 7,812,435 - Park , et al. October 12, 2	2010-10-12
Integrated Circuit Packaging System With Post Type Interconnector And Method Of Manufacture Thereof App 20100244212 - Ha; Jong-Woo ; et al.	2010-09-30
Integrated Circuit Packaging System With Stacked Configuration And Method Of Manufacture Thereof App 20100244217 - Ha; Jong-Woo ; et al.	2010-09-30
Integrated Circuit Package-in-package System And Method For Making Thereof App 20100230796 - Yim; Choong Bin ; et al.	2010-09-16
Stacked Integrated Circuit Package System And Method For Manufacturing Thereof App 20100224979 - Carson; Flynn ; et al.	2010-09-09
Stacked integrated circuit package-in-package system Grant 7,772,683 - Jang , et al. August 10, 2	2010-08-10
Integrated circuit package-in-package system Grant 7,755,180 - Yim , et al. July 13, 2	2010-07-13
Stacked integrated circuit package system Grant 7,750,454 - Carson , et al. July 6, 2	2010-07-06
Integrated circuit package system with stacking module Grant 7,741,154 - Ha , et al. June 22, 2	2010-06-22
Integrated Circuit Packaging System With Lead Frame And Method Of Manufacture Thereof App 20100133665 - Ha; Jong-Woo ; et al.	2010-06-03
Integrated Circuit Packaging System Having An Internal Structure Protrusion And Method Of Manufacture Thereof App 20100123232 - Choi; DaeSik ; et al.	2010-05-20
Integrated Circuit Package System With Support Carrier And Method Of Manufacture Thereof App 20100123242 - Ha; Jong-Woo ; et al.	2010-05-20
Mountable integrated circuit package-in-package system with adhesive spacing structures Grant 7,687,897 - Ha , et al. March 30, 2	2010-03-30
Planar Encapsulation And Mold Cavity Package In Package System App 20100072634 - Ha; Jong-Woo ; et al.	2010-03-25
Stacked die package system Grant 7,674,640 - Ha , et al. March 9, 2	2010-03-09
Stacked Integrated Circuit Package-in-package System And Method Of Manufacture Thereof App 20100044849 - Kim; OhSug ; et al.	2010-02-25
Integrated Circuit Package System Having Cavity App 20100044878 - Ha; Jong-Woo ; et al.	2010-02-25
Integrated circuit package-in-package system with carrier interposer Grant 7,659,609 - Ha , et al. February 9, 2	2010-02-09
Integrated circuit package system including stacked die Grant 7,652,376 - Park , et al. January 26, 2	2010-01-26
Integrated Circuit Packaging System With Embedded Circuitry And Post, And Method Of Manufacture Thereof App 20090315170 - Shim; Il Kwon ; et al.	2009-12-24
Stacked integrated circuit package-in-package system Grant 7,635,913 - Kim , et al. December 22, 2	2009-12-22
Ball Grid Array Package Stacking System App 20090309204 - Ha; Jong-Woo	2009-12-17
Integrated Circuit Package On Package System App 20090273094 - Ha; Jong-Woo ; et al.	2009-11-05
Stacked Integrated Circuit Package System App 20090243072 - Ha; Jong-Woo ; et al.	2009-10-01
Stacked Integrated Circuit Package System App 20090243073 - Carson; Flynn ; et al.	2009-10-01
Integrated Circuit Package System With Stacking Module App 20090243071 - Ha; Jong-Woo ; et al.	2009-10-01
Integrated Circuit Package System With Flip Chip App 20090152740 - Park; Soo-San ; et al.	2009-06-18
Integrated Circuit Packaging System With Carrier And Method Of Manufacture Thereof App 20090134509 - Yim; Choong Bin ; et al.	2009-05-28
Integrated Circuit Packaging System With Base Structure Device App 20090085178 - Ha; Jong-Woo ; et al.	2009-04-02
Integrated Circuit Package System With Multi-chip Module App 20090072375 - Song; Sungmin ; et al.	2009-03-19
Integrated circuit package system Grant 7,501,697 - Yim , et al. March 10, 2	2009-03-10
Integrated Circuit Package-in-package System With Carrier Interposer App 20090057862 - Ha; Jong-Woo ; et al.	2009-03-05
Integrated Circuit Package System Employing An Offset Stacked Configuration App 20090057864 - Choi; DaeSik ; et al.	2009-03-05
Integrated Circuit Package-in-package System With Side-by-side And Offset Stacking App 20090057861 - Park; Soo-San ; et al.	2009-03-05
Stacked integrated circuit package-in-package system Grant 7,498,667 - Ha , et al. March 3, 2	2009-03-03
Integrated Circuit Package System Including Stacked Die App 20090014899 - Park; Soo-San ; et al.	2009-01-15
Integrated Circuit Package System With Symmetric Packaging App 20090001549 - Park; Soo-San ; et al.	2009-01-01
Integrated circuit package system including stacked die Grant 7,456,088 - Park , et al. November 25, 2	2008-11-25
Stacked integrated circuit package-in-package system Grant 7,420,269 - Ha , et al. September 2, 2	2008-09-02
Mountable Integrated Circuit Package-in-package System With Adhesive Spacing Structures App 20080157319 - Ha; Jong-Woo ; et al.	2008-07-03
Stacked Integrated Circuit Package-in-package System App 20080136006 - Jang; Ki Youn ; et al.	2008-06-12
Stacked Integrated Circuit Package-in-package System App 20080136007 - Kim; OhSug ; et al.	2008-06-12
Stacked integrated circuit package-in-package system Grant 7,368,319 - Ha , et al. May 6, 2	2008-05-06
Integrated Circuit Package System Employing Bump Technology App 20080079130 - Ha; Jong-Woo ; et al.	2008-04-03
Integrated Circuit Package System With Waferscale Spacer App 20080042245 - Lee; Sang-Ho ; et al.	2008-02-21
Integrated Circuit Package System Including Wafer Level Spacer App 20080012095 - Lee; Sang-Ho ; et al.	2008-01-17
Integrated Circuit Packaging System With Ultra-thin Die App 20080006921 - Park; Soo-San ; et al.	2008-01-10
Integrated Circuit Package-in-package System App 20080006925 - Yim; Choong Bin ; et al.	2008-01-10
Stacked Die Package System App 20070284718 - Ha; Jong-Woo ; et al.	2007-12-13
Integrated circuit package-in-package system Grant 7,288,835 - Yim , et al. October 30, 2	2007-10-30
Stacked Integrated Circuit Package-in-package System App 20070241442 - Ha; Jong-Woo ; et al.	2007-10-18
Stacked Integrated Circuit Package-in-package System App 20070241453 - Ha; Jong-Woo ; et al.	2007-10-18
Integrated Circuit Package System With Net Spacer App 20070235846 - Lee; Sang-Ho ; et al.	2007-10-11
Stacked die package system Grant 7,279,785 - Ha , et al. October 9, 2	2007-10-09
Integrated Circuit Package-in-package System App 20070216005 - Yim; Choong Bin ; et al.	2007-09-20
Integrated Circuit Package System App 20070216010 - Yim; Choong Bin ; et al.	2007-09-20
Stacked Integrated Circuit Package-in-package System App 20070218689 - Ha; Jong-Woo ; et al.	2007-09-20
Stacked Integrated Circuit Package System With Face To Face Stack Configuration App 20070181998 - Ha; Jong-Woo ; et al.	2007-08-09
Integrated Circuit Package System Including Stacked Die App 20070158833 - Park; Soo-San ; et al.	2007-07-12
Stacked Die Package System App 20060180914 - Ha; Jong-Woo ; et al.	2006-08-17