Gwon; Jin Ho

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gwon; Jin Ho.The latest application filed is for "wearable device and operation method therefor".

Company Profile

2.8.10

Gwon; Jin Ho - Seoul KR
Gwon; Jin Ho - Osan-si KR
Gwon; Jin Ho - Gyeonggi-do KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Wearable device and operation method therefor Grant 11,076,759 - Kim , et al. August 3, 2	2021-08-03
Wrist-worn apparatus for detecting bio-signal Grant 10,617,360 - Jeon , et al.	2020-04-14
Antenna system using a motion sensor and method for operating the antenna system using a motion sensor Grant 10,454,159 - Jeon , et al. Oc	2019-10-22
Wearable Device And Operation Method Therefor App 20190029521 - KIM; CHUL ; et al.	2019-01-31
Solar cell and method for manufacturing same Grant 10,069,022 - Gwon September 4, 2	2018-09-04
Antenna System Using A Motion Sensor And Method For Operating The Antenna System Using A Motion Sensor App 20170366281 - JEON; Seul Ki ; et al.	2017-12-21
Wrist-worn Apparatus For Detecting Bio-signal App 20170188953 - Jeon; Seul Ki ; et al.	2017-07-06
Solar Cell and Method for Manufacturing Same App 20160268454 - GWON; Jin Ho	2016-09-15
Semiconductor package and stacked semiconductor package having the same Grant 9,070,691 - Oh , et al. June 30, 2	2015-06-30
Solar Cell And Method Of Fabricating The Same App 20150136218 - Gwon; Jin Ho	2015-05-21
Solar Cell And Method Of Fabricating The Same App 20150129028 - Gwon; Jin Ho	2015-05-14
Semiconductor Package And Stacked Semiconductor Package Having The Same App 20140332946 - OH; Jae Sung ; et al.	2014-11-13
Semiconductor package and stacked semiconductor package having the same Grant 8,823,158 - Oh , et al. September 2, 2	2014-09-02
Semiconductor Package And Stacked Semiconductor Package Having The Same App 20130026651 - OH; Jae Sung ; et al.	2013-01-31
Semiconductor package and stacked semiconductor package having the same Grant 8,299,591 - Oh , et al. October 30, 2	2012-10-30
Substrate for semiconductor package having a reinforcing member that prevents distortions and method for fabricating the same Grant 8,024,857 - Jung , et al. September 27, 2	2011-09-27
Substrate For Semiconductor Package Having A Reinforcing Member That Prevents Distortions And Method For Fabricating The Same App 20100117200 - JUNG; Young Hy ; et al.	2010-05-13
Semiconductor Package And Stacked Semiconductor Package Having The Same App 20100072598 - OH; Jae Sung ; et al.	2010-03-25

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