Gutt; Thomas

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gutt; Thomas.The latest application filed is for "production of an integrated circuit including electrical contact on sic".

Company Profile

1.20.16

Gutt; Thomas - Taufkirchen DE
Gutt; Thomas - Hohenbrunn DE
Gutt; Thomas - Buehl DE
Gutt; Thomas - US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Production of an integrated circuit including electrical contact on SiC Grant 10,347,490 - Rupp , et al. July 9, 2	2019-07-09
PRODUCTION OF AN INTEGRATED CIRCUIT INCLUDING ELECTRICAL CONTACT ON SiC App 20170200610 - Rupp; Roland ; et al.	2017-07-13
Method of manufacturing a device by locally heating one or more metalization layers and by means of selective etching Grant 9,634,108 - Rupp , et al. April 25, 2	2017-04-25
Method for forming a semiconductor device Grant 9,613,805 - Schustereder , et al. April 4, 2	2017-04-04
Method of manufacturing a device by locally heating one or more metalization layers and by means of selective etching Grant 9,391,154 - Rupp , et al. July 12, 2	2016-07-12
Method of Manufacturing a Device by Locally Heating One or More Metalization Layers and by Means of Selective Etching App 20160155861 - Rupp; Roland ; et al.	2016-06-02
Method of Manufacturing a Device by Locally Heating One or More Metalization Layers and by Means of Selective Etching App 20160064504 - Rupp; Roland ; et al.	2016-03-03
IGBT with emitter electrode electrically connected with impurity zone Grant 9,240,450 - Werber , et al. January 19, 2	2016-01-19
IGBT with emitter electrode electrically connected with an impurity zone Grant 9,209,109 - Werber , et al. December 8, 2	2015-12-08
Method of manufacturing a device by locally heating one or more metallization layers and by means of selective etching Grant 9,209,281 - Rupp , et al. December 8, 2	2015-12-08
Semiconductor Device, Method for Manufacturing the Same and IGBT with Emitter Electrode Electrically Connected with Impurity Zone App 20150228723 - Werber; Dorothea ; et al.	2015-08-13
PRODUCTION OF AN INTEGRATED CIRCUIT INCLUDING ELECTRICAL CONTACT ON SiC App 20150041831 - Rupp; Roland ; et al.	2015-02-12
IGBT with Emitter Electrode Electrically Connected with an Impurity Zone App 20150014743 - Werber; Dorothea ; et al.	2015-01-15
Production of an integrated circuit including electrical contact on SiC Grant 8,895,422 - Rupp , et al. November 25, 2	2014-11-25
Bonding connection between a bonding wire and a power semiconductor chip Grant 8,541,892 - Siepe , et al. September 24, 2	2013-09-24
PRODUCTION OF AN INTEGRATED CIRCUIT INCLUDING ELECTRICAL CONTACT ON SiC App 20130193449 - Rupp; Roland ; et al.	2013-08-01
Outer plate carrier Grant 8,475,326 - Noehl , et al. July 2, 2	2013-07-02
Production of an integrated circuit including electrical contact on SiC Grant 8,450,196 - Rupp , et al. May 28, 2	2013-05-28
Outer Plate Carrier App 20120267211 - Noehl; Oliver ; et al.	2012-10-25
Method for oxidizing a layer, and associated holding devices for a substrate Grant 8,011,319 - Chung , et al. September 6, 2	2011-09-06
Bonding Connection Between a Bonding Wire and a Power Semiconductor Chip App 20110121458 - Siepe; Dirk ; et al.	2011-05-26
Semiconductor device including a power device with first metal layer and second metal layer laterally spaced apart Grant 7,851,913 - Gutt , et al. December 14, 2	2010-12-14
Method for manufacturing a semiconductor substrate including laser annealing Grant 7,842,590 - Gutt , et al. November 30, 2	2010-11-30
Method for producing and cleaning surface-mountable bases with external contacts Grant 7,723,158 - Gutt , et al. May 25, 2	2010-05-25
Method For Oxidizing A Layer, And Associated Holding Devices For A Substrate App 20100018462 - Chung; Hin-Yiu ; et al.	2010-01-28
Method for oxidizing a layer, and associated holding devices for a substrate Grant 7,615,499 - Chung , et al. November 10, 2	2009-11-10
Method For Manufacturing A Semiconductor Substrate Including Laser Annealing App 20090267200 - Gutt; Thomas ; et al.	2009-10-29
Method of manufacturing a device by locally heating one or more metallization layers and by means of selective etching App 20080258183 - Rupp; Roland ; et al.	2008-10-23
Semiconductor device and method for producing a semiconductor device App 20080122091 - Gutt; Thomas ; et al.	2008-05-29
PRODUCTION OF AN INTEGRATED CIRCUIT INCLUDING ELECTRICAL CONTACT ON SiC App 20080099769 - Rupp; Roland ; et al.	2008-05-01
Method For Producing And Cleaning Surface-Mountable Bases With External Contacts App 20070111527 - Gutt; Thomas ; et al.	2007-05-17
Method for oxidation of a layer and corresponding holder device for a substrate App 20060057858 - Chung; Hin-Yiu ; et al.	2006-03-16

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