Guth; Karsten

Patent Applications and Registrations

Patent applications and USPTO patent grants for Guth; Karsten.The latest application filed is for "electronic module and method for producing an electronic module".

Company Profile

0.25.21

Guth; Karsten - Soest DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic module and method for producing an electronic module Grant 9,768,035 - Guth , et al. September 19, 2	2017-09-19
Electronic Module and Method for Producing an Electronic Module App 20160104631 - Guth; Karsten ; et al.	2016-04-14
Power semiconductor module, method for producing a power semiconductor module, and semiconductor chip Grant 9,214,442 - Guth , et al. December 15, 2	2015-12-15
Die fixing method and apparatus Grant 8,691,624 - Ciliox , et al. April 8, 2	2014-04-08
Device including a semiconductor chip and a carrier and fabrication method Grant 8,637,379 - Eder , et al. January 28, 2	2014-01-28
Method of fabricating a semiconductor device Grant 8,603,864 - Riedl , et al. December 10, 2	2013-12-10
Power semiconductor arrangement and method for producing a power semiconductor arrangement Grant 8,586,420 - Stolze , et al. November 19, 2	2013-11-19
Method for producing a power semiconductor arrangement Grant 8,563,364 - Stolze , et al. October 22, 2	2013-10-22
Die Fixing Method and Apparatus App 20130137215 - Ciliox; Alexander ; et al.	2013-05-30
Device and method for making a semiconductor device including bonding two bonding partners Grant 8,439,249 - Speckels , et al. May 14, 2	2013-05-14
Module including a sintered joint bonding a semiconductor chip to a copper surface Grant 8,415,207 - Guth , et al. April 9, 2	2013-04-09
Power Semiconductor Arrangement And Method For Producing A Power Semiconductor Arrangement App 20130082387 - Stolze; Thilo ; et al.	2013-04-04
Method For Producing A Power Semiconductor Arrangement App 20130084679 - Stolze; Thilo ; et al.	2013-04-04
Module Including A Sintered Joint Bonding A Semiconductor Chip To A Copper Surface App 20120312864 - Guth; Karsten ; et al.	2012-12-13
Module including a sintered joint bonding a semiconductor chip to a copper surface Grant 8,253,233 - Guth , et al. August 28, 2	2012-08-28
Method for mounting electronic components on a support Grant 8,209,858 - Speckels , et al. July 3, 2	2012-07-03
Method for connecting a component with a substrate Grant 8,104,667 - Guth , et al. January 31, 2	2012-01-31
Device Including A Semiconductor Chip And A Carrier And Fabrication Method App 20110084369 - Eder; Hannes ; et al.	2011-04-14
Method for Connecting a Component With a Substrate App 20110017803 - Guth; Karsten ; et al.	2011-01-27
Apparatus and method for producing semiconductor modules Grant 7,851,334 - Speckels , et al. December 14, 2	2010-12-14
Apparatus and method for connecting a component with a substrate Grant 7,793,819 - Guth , et al. September 14, 2	2010-09-14
Method for production of a semiconductor component Grant 7,757,390 - Schneegans , et al. July 20, 2	2010-07-20
Device And Method For Making A Semiconductor Device Including Bonding Two Bonding Partners App 20100078463 - SPECKELS; Roland ; et al.	2010-04-01
Method for fabricating a module including a sintered joint Grant 7,682,875 - Guth , et al. March 23, 2	2010-03-23
Module Including A Stable Solder Joint App 20100068552 - Goerlich; Jens ; et al.	2010-03-18
Method Of Fabricating A Semiconductor Device App 20100059857 - Riedl; Edmund ; et al.	2010-03-11
Module Including A Sintered Joint App 20090294963 - Guth; Karsten ; et al.	2009-12-03
Module Including A Sintered Joint Bonding A Semiconductor Chip To A Copper Surface App 20090206456 - Guth; Karsten ; et al.	2009-08-20
Semiconductor chip attachment Grant 7,555,832 - Guth , et al. July 7, 2	2009-07-07
Apparatus And Method For Producing Semiconductor Modules App 20090023250 - Speckels; Roland ; et al.	2009-01-22
Semiconductor Chip Attachment App 20080229575 - Guth; Karsten ; et al.	2008-09-25
Power Semiconductor Module, Method for Producing a Power Semiconductor Module, and Semiconductor Chip App 20080230905 - Guth; Karsten ; et al.	2008-09-25
Apparatus And Method For Connecting A Component With A Substrate App 20080230589 - Guth; Karsten ; et al.	2008-09-25
Bonding Head, Bonding Tool and Method for Production of a Semiconductor Component App 20080005893 - Schneegans; Manfred ; et al.	2008-01-10
Arrangement For Mounting Electronic Components On A Support App 20070175021 - Speckels; Roland ; et al.	2007-08-02

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