Gurumurthy; Charavana K.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Gurumurthy; Charavana K..The latest application filed is for "compartment for magnet placement".

Company Profile

1.9.9

Gurumurthy; Charavana K. - Gilbert AZ
Gurumurthy; Charavana K. - Chandler AZ US
Gurumurthy; Charavana K. - Higley AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Compartment for magnet placement Grant 10,317,952 - Iyer , et al.	2019-06-11
Flexible microelectronic systems and methods of fabricating the same Grant 10,103,037 - Aleksov , et al. October 16, 2	2018-10-16
Compartment For Magnet Placement App 20180095503 - IYER; Sandeep S. ; et al.	2018-04-05
Pad-less interconnect for electrical coreless substrate Grant 9,691,727 - Soto Gonzalez , et al. June 27, 2	2017-06-27
Enabling package-on-package (PoP) pad surface finishes on bumpless build-up layer (BBUL) package Grant 9,299,602 - Zhang , et al. March 29, 2	2016-03-29
Flexible Microelectronic Systems And Methods Of Fabricating The Same App 20150325491 - Aleksov; Aleksandar ; et al.	2015-11-12
Processes Of Making Pad-less Interconnect For Electrical Coreless Substrate App 20150221608 - SOTO GONZALEZ; Javier ; et al.	2015-08-06
Enabling Package-on-package (pop) Pad Surface Finishes On Bumpless Build-up Layer (bbul) Package App 20130320547 - Zhang; Qinglei ; et al.	2013-12-05
Through mold via polymer block package Grant 8,450,857 - Roy , et al. May 28, 2	2013-05-28
Through Mold Via Polymer Block Package App 20120299179 - Roy; Mihir K. ; et al.	2012-11-29
Through mold via polymer block package Grant 8,278,214 - Roy , et al. October 2, 2	2012-10-02
Through Mold Via Polymer Block Package App 20110147929 - Roy; Mihir K. ; et al.	2011-06-23
Method of substrate manufacture that decreases the package resistance Grant 7,432,202 - Saha , et al. October 7, 2	2008-10-07
Method of substrate manufacture that decreases the package resistance App 20070148971 - Saha; Bijay S. ; et al.	2007-06-28

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